Welding induced alignment distortion in dual-in-line LD packages

Wenning Liu, Xin Sun, M. Khaleel, Frank G. Shi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The tolerance for the movement of a single mode fiber relative to the laser is extremely tight, a submicron movement can often lead to a significant misalignment and thus the reduction in the power coupled into the fiber. Among various fiber pigtailing assembly technologies, pulsed laser welding is the method with submicron accuracy and is most conducive to automation. However, the melting-solidification process during laser welding can often distort the pre-achieved fiber-optic alignment. This Welding-Induced-Alignment-Distortion (WIAD) is a serious concern and significantly affects the yield for single mode fiber pigtailing to a semiconductor laser. In this paper, effect of laser welding sequence on WIAD in a dual-in-line packager is numerically investigated by means of Finite Element Method (FEM). Optimal welding sequence may minimize WIAD in dual-in-line package. Additionally, unsymmetrical space between fiber and U-channel induced by laser welding of U-channel-to-plate in DIP LD packages is found to have obvious effect on WIAD.

Original languageEnglish
Title of host publicationProceedings - 2007 International Symposium on Microelectronics, IMAPS 2007
Pages116-122
Number of pages7
Publication statusPublished - 1 Dec 2007
Event40th International Symposium on Microelectronics, IMAPS 2007 - San Jose, CA, United States
Duration: 11 Nov 200715 Nov 2007

Publication series

NameProceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Other

Other40th International Symposium on Microelectronics, IMAPS 2007
CountryUnited States
CitySan Jose, CA
Period11/11/0715/11/07

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Keywords

  • Dual-in-Line (DIP) laser diode packages
  • Laser welding
  • Weld-Induced-Alignment-Distortion (WIAD)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Liu, W., Sun, X., Khaleel, M., & Shi, F. G. (2007). Welding induced alignment distortion in dual-in-line LD packages. In Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007 (pp. 116-122). (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).