Thermo- fluidic characteristics in a cross-linked silicon microchannel heat sink

R. Muwanga, I. Hassan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper presents the flow and heat transfer characteristics in a cross-linked silicon microchannel heat sink. The heat sink is composed of 45 channels, 270 μm wide × 285 μm tall in a silicon substrate formed via deep reactive ion etching. A detailed discussion of the pressure drop data reduction is described, including characterization of the channel cross-sections and methods to account for inlet and exit loss coefficients. No significant difference is observed in the pressure drop measurements between the cross-linked and standard heat sinks flowing air and water. The use of unencapsulated liquid crystal thermography was successfully utilized to obtain local heat transfer data with FC-72 as the working fluid. The heat transfer results show inflections in the thermal profile due to the cross-links.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Pages969-978
Number of pages10
DOIs
Publication statusPublished - 1 Dec 2007
Externally publishedYes
Event2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007 - Vancouver, BC, Canada
Duration: 8 Jul 200712 Jul 2007

Publication series

Name2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Volume2

Other

Other2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
CountryCanada
CityVancouver, BC
Period8/7/0712/7/07

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics

Cite this

Muwanga, R., & Hassan, I. (2007). Thermo- fluidic characteristics in a cross-linked silicon microchannel heat sink. In 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007 (pp. 969-978). (2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007; Vol. 2). https://doi.org/10.1115/HT2007-32290