Thermal considerations in cooling large scale high compute density data centers

Chandrakant D. Patel, Ratnesh Sharma, Cullen E. Bash, Abdlmonem Beitelmal

Research output: Chapter in Book/Report/Conference proceedingConference contribution

81 Citations (Scopus)

Abstract

A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today's data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
EditorsC.H. Amon, K. Ramakrishna, B.G. Sammakia, G. Subbarayan, S.B. Sathe, Y.K. Joshi
Pages767-776
Number of pages10
Publication statusPublished - 1 Jan 2002
Externally publishedYes
Event8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States
Duration: 30 May 20021 Jun 2002

Other

Other8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems
CountryUnited States
CitySan Diego, CA
Period30/5/021/6/02

Fingerprint

Cooling
Heat losses
Air conditioning
Microprocessor chips
Servers
Hot Temperature
Costs

Keywords

  • Data center
  • Modeling
  • Provisioning
  • Thermal management

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Patel, C. D., Sharma, R., Bash, C. E., & Beitelmal, A. (2002). Thermal considerations in cooling large scale high compute density data centers. In C. H. Amon, K. Ramakrishna, B. G. Sammakia, G. Subbarayan, S. B. Sathe, & Y. K. Joshi (Eds.), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (pp. 767-776)

Thermal considerations in cooling large scale high compute density data centers. / Patel, Chandrakant D.; Sharma, Ratnesh; Bash, Cullen E.; Beitelmal, Abdlmonem.

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. ed. / C.H. Amon; K. Ramakrishna; B.G. Sammakia; G. Subbarayan; S.B. Sathe; Y.K. Joshi. 2002. p. 767-776.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Patel, CD, Sharma, R, Bash, CE & Beitelmal, A 2002, Thermal considerations in cooling large scale high compute density data centers. in CH Amon, K Ramakrishna, BG Sammakia, G Subbarayan, SB Sathe & YK Joshi (eds), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. pp. 767-776, 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, San Diego, CA, United States, 30/5/02.
Patel CD, Sharma R, Bash CE, Beitelmal A. Thermal considerations in cooling large scale high compute density data centers. In Amon CH, Ramakrishna K, Sammakia BG, Subbarayan G, Sathe SB, Joshi YK, editors, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2002. p. 767-776
Patel, Chandrakant D. ; Sharma, Ratnesh ; Bash, Cullen E. ; Beitelmal, Abdlmonem. / Thermal considerations in cooling large scale high compute density data centers. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. editor / C.H. Amon ; K. Ramakrishna ; B.G. Sammakia ; G. Subbarayan ; S.B. Sathe ; Y.K. Joshi. 2002. pp. 767-776
@inproceedings{c9ee912368b44760a2f3a4fb1fc36518,
title = "Thermal considerations in cooling large scale high compute density data centers",
abstract = "A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today's data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.",
keywords = "Data center, Modeling, Provisioning, Thermal management",
author = "Patel, {Chandrakant D.} and Ratnesh Sharma and Bash, {Cullen E.} and Abdlmonem Beitelmal",
year = "2002",
month = "1",
day = "1",
language = "English",
pages = "767--776",
editor = "C.H. Amon and K. Ramakrishna and B.G. Sammakia and G. Subbarayan and S.B. Sathe and Y.K. Joshi",
booktitle = "Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference",

}

TY - GEN

T1 - Thermal considerations in cooling large scale high compute density data centers

AU - Patel, Chandrakant D.

AU - Sharma, Ratnesh

AU - Bash, Cullen E.

AU - Beitelmal, Abdlmonem

PY - 2002/1/1

Y1 - 2002/1/1

N2 - A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today's data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.

AB - A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today's data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.

KW - Data center

KW - Modeling

KW - Provisioning

KW - Thermal management

UR - http://www.scopus.com/inward/record.url?scp=0036459835&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036459835&partnerID=8YFLogxK

M3 - Conference contribution

SP - 767

EP - 776

BT - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

A2 - Amon, C.H.

A2 - Ramakrishna, K.

A2 - Sammakia, B.G.

A2 - Subbarayan, G.

A2 - Sathe, S.B.

A2 - Joshi, Y.K.

ER -