Thermal considerations in cooling large scale high compute density data centers

Chandrakant D. Patel, Ratnesh Sharma, Cullen E. Bash, Abdlmonem Beitelmal

Research output: Contribution to conferencePaper

85 Citations (Scopus)

Abstract

A high compute density data center of today is characterized as one consisting of thousands of racks each with multiple computing units. The computing units include multiple microprocessors, each dissipating approximately 250 W of power. The heat dissipation from a rack containing such computing units exceeds 10 KW. Today's data center, with 1000 racks, over 30,000 square feet, requires 10 MW of power for the computing infrastructure. A 100,000 square foot data center of tomorrow will require 50 MW of power for the computing infrastructure. Energy required to dissipate this heat will be an additional 20 MW. A hundred thousand square foot planetary scale data center, with five thousand 10 KW racks, would cost ∼$44 million per year (@ $100/MWh) just to power the servers & $18 million per year to power the cooling infrastructure for the data center. Cooling design considerations by virtue of proper layout of racks can yield substantial savings in energy. This paper shows an overview of a data center cooling design and presents the results of a case study where layout change was made by virtue of numerical modeling to avail efficient use of air conditioning resources.

Original languageEnglish
Pages767-776
Number of pages10
Publication statusPublished - 1 Jan 2002
Event8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States
Duration: 30 May 20021 Jun 2002

Other

Other8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems
CountryUnited States
CitySan Diego, CA
Period30/5/021/6/02

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Keywords

  • Data center
  • Modeling
  • Provisioning
  • Thermal management

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Patel, C. D., Sharma, R., Bash, C. E., & Beitelmal, A. (2002). Thermal considerations in cooling large scale high compute density data centers. 767-776. Paper presented at 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, San Diego, CA, United States.