The Era of Big Spatial Data: Challenges and Opportunities

Ahmed Eldawy, Mohamed Mokbel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This seminar describes the state-of-the-art research in the area of big spatial data and it consists of four parts. Part I gives a background about big spatial data and the limitations of traditional systems in handling such data. Part II gives an overview of the four main components that constitute a system for big spatial data, namely, language, indexing, query processing, and visualization. In part III, we delve into the details of each of these four components and describe the recent research efforts in each component while highlighting the open research problems. Finally, part IV wraps up the seminar by describing case studies of systems and end-user applications for big spatial data. This part describes how the four components are implemented in these systems and how they are used in end-user applications.

Original languageEnglish
Title of host publicationProceedings - 2015 IEEE 16th International Conference on Mobile Data Management, MDM 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages7-10
Number of pages4
Volume2
ISBN (Electronic)9781479999729
DOIs
Publication statusPublished - 11 Sep 2015
Externally publishedYes
Event16th IEEE International Conference on Mobile Data Management, MDM 2015 - Pittsburgh, United States
Duration: 15 Jun 201518 Jun 2015

Other

Other16th IEEE International Conference on Mobile Data Management, MDM 2015
CountryUnited States
CityPittsburgh
Period15/6/1518/6/15

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Keywords

  • Big Data
  • Big Spatial Data
  • Hadoop
  • HBase
  • Hive
  • Impala
  • MapReduce
  • Spark

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Eldawy, A., & Mokbel, M. (2015). The Era of Big Spatial Data: Challenges and Opportunities. In Proceedings - 2015 IEEE 16th International Conference on Mobile Data Management, MDM 2015 (Vol. 2, pp. 7-10). [7264361] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MDM.2015.82