The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate

Amir Abdallah, P. C P Bouten, J. M J den Toonder, G. de With

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.

Original languageEnglish
Pages (from-to)1063-1073
Number of pages11
JournalThin Solid Films
Volume516
Issue number6
DOIs
Publication statusPublished - 30 Jan 2008
Externally publishedYes

Fingerprint

Telephone cords
telephones
Delamination
moisture
Polymers
Moisture
buckling
Buckling
humidity
Atmospheric humidity
polymers
Substrates
Energy release rate
failure modes
toughness
Failure modes
Toughness
energy

Keywords

  • Adhesion
  • Delamination
  • Moisture absorption
  • Thin layers

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate. / Abdallah, Amir; Bouten, P. C P; den Toonder, J. M J; de With, G.

In: Thin Solid Films, Vol. 516, No. 6, 30.01.2008, p. 1063-1073.

Research output: Contribution to journalArticle

Abdallah, Amir ; Bouten, P. C P ; den Toonder, J. M J ; de With, G. / The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate. In: Thin Solid Films. 2008 ; Vol. 516, No. 6. pp. 1063-1073.
@article{90fd8025583a45f6ade25b263a0b95d4,
title = "The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate",
abstract = "Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.",
keywords = "Adhesion, Delamination, Moisture absorption, Thin layers",
author = "Amir Abdallah and Bouten, {P. C P} and {den Toonder}, {J. M J} and {de With}, G.",
year = "2008",
month = "1",
day = "30",
doi = "10.1016/j.tsf.2007.06.157",
language = "English",
volume = "516",
pages = "1063--1073",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "6",

}

TY - JOUR

T1 - The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate

AU - Abdallah, Amir

AU - Bouten, P. C P

AU - den Toonder, J. M J

AU - de With, G.

PY - 2008/1/30

Y1 - 2008/1/30

N2 - Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.

AB - Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.

KW - Adhesion

KW - Delamination

KW - Moisture absorption

KW - Thin layers

UR - http://www.scopus.com/inward/record.url?scp=37349023374&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=37349023374&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2007.06.157

DO - 10.1016/j.tsf.2007.06.157

M3 - Article

AN - SCOPUS:37349023374

VL - 516

SP - 1063

EP - 1073

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

IS - 6

ER -