The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate

A. A. Abdallah, P. C.P. Bouten, J. M.J. den Toonder, G. de With

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26 Citations (Scopus)

Abstract

Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.

Original languageEnglish
Pages (from-to)1063-1073
Number of pages11
JournalThin Solid Films
Volume516
Issue number6
DOIs
Publication statusPublished - 30 Jan 2008

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Keywords

  • Adhesion
  • Delamination
  • Moisture absorption
  • Thin layers

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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