Quantifying the interfacial strength of oxide scale and SS 441 substrate used in SOFC

W. N. Liu, X. Sun, E. Stephens, M. Khaleel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Under a typical SOFC working environment, oxide scale will grow on the metallic interconnects in oxidant environment. The growth of the oxide scale induces the growth stresses in the oxide scale and on the scale/substrate interface combined with the thermal stresses induced by thermal expansion coefficient mismatch between the oxide scale and the substrate, which may lead to scale delamination/buckling and eventual spallation during stack cooling, even leading to serious cell performance degradation. Therefore, the interfacial adhesion strength between the oxide scale and substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. As a powerful contender of ferritic interconnects used in SOFC, its interfacial strength between the oxide scale and SS 441 substrate is very important for its application. In this paper, we applied an integrated experimental/analytical methodology to quantify the interfacial adhesion strength between oxide scale and metallic interconnect. The predicted interfacial strength is discussed in detailed.

Original languageEnglish
Title of host publicationMaterials Science and Technology Conference and Exhibition 2009, MS and T'09
Pages338-347
Number of pages10
Volume1
Publication statusPublished - 1 Dec 2009
Externally publishedYes
EventMaterials Science and Technology Conference and Exhibition 2009, MS and T'09 - Pittsburgh, PA, United States
Duration: 25 Oct 200929 Oct 2009

Other

OtherMaterials Science and Technology Conference and Exhibition 2009, MS and T'09
CountryUnited States
CityPittsburgh, PA
Period25/10/0929/10/09

Fingerprint

Solid oxide fuel cells (SOFC)
Oxides
Substrates
Bond strength (materials)
Oxidants
Delamination
Thermal stress
Buckling
Thermal expansion
Durability
Cooling
Degradation

Keywords

  • Interfacial strength
  • Oxide scale
  • SOFC
  • Stainless steel 441

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Liu, W. N., Sun, X., Stephens, E., & Khaleel, M. (2009). Quantifying the interfacial strength of oxide scale and SS 441 substrate used in SOFC. In Materials Science and Technology Conference and Exhibition 2009, MS and T'09 (Vol. 1, pp. 338-347)

Quantifying the interfacial strength of oxide scale and SS 441 substrate used in SOFC. / Liu, W. N.; Sun, X.; Stephens, E.; Khaleel, M.

Materials Science and Technology Conference and Exhibition 2009, MS and T'09. Vol. 1 2009. p. 338-347.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liu, WN, Sun, X, Stephens, E & Khaleel, M 2009, Quantifying the interfacial strength of oxide scale and SS 441 substrate used in SOFC. in Materials Science and Technology Conference and Exhibition 2009, MS and T'09. vol. 1, pp. 338-347, Materials Science and Technology Conference and Exhibition 2009, MS and T'09, Pittsburgh, PA, United States, 25/10/09.
Liu WN, Sun X, Stephens E, Khaleel M. Quantifying the interfacial strength of oxide scale and SS 441 substrate used in SOFC. In Materials Science and Technology Conference and Exhibition 2009, MS and T'09. Vol. 1. 2009. p. 338-347
Liu, W. N. ; Sun, X. ; Stephens, E. ; Khaleel, M. / Quantifying the interfacial strength of oxide scale and SS 441 substrate used in SOFC. Materials Science and Technology Conference and Exhibition 2009, MS and T'09. Vol. 1 2009. pp. 338-347
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