Numerically investigating the effects of cross links in scaled microchannel heat sinks

M. Dang, I. Hassan, S. I. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Thermal management for high performance of miniaturized electronic devices using microchannel heat sinks has recently become of interest to researchers and industry. Obtaining heat sink designs with uniform flow distribution is strongly desired. A number of experimental studies have been conducted to seek appropriate designs for microchannel heat sinks. However, pursuing this goal experimentally can be an expensive endeavor. The present work investigates the effect of cross-links on adiabatic two-phase flow in an array of parallel channels. It is carried out using the three-dimensional mixture model from the computational fluid dynamics (CFD) software, Fluent 6.3. A straight channel and two cross-linked channel models were simulated. The cross-links were located at 1/3 and 2/3's of the channel length, their width varied by one and two times the channel width. All test models had 45 parallel rectangular channels, with a hydraulic diameter of 1.59 mm. The results showed that the trend of flow distribution agrees with experimental results. A new design, with cross-links incorporated, was proposed and the results showed a significant improvement, up to 55%, on flow distribution, compared to the standard straight channel configuration without a penalty in the pressure drop. The effect of cross-links on flow distribution, flow structure, and pressure drop was also documented.

Original languageEnglish
Title of host publicationCollection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007
Pages54-59
Number of pages6
DOIs
Publication statusPublished - 1 Dec 2007
Event13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007 - Budapest, Hungary
Duration: 17 Sep 200719 Sep 2007

Publication series

NameCollection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Other

Other13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007
CountryHungary
CityBudapest
Period17/9/0719/9/07

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Dang, M., Hassan, I., & Kim, S. I. (2007). Numerically investigating the effects of cross links in scaled microchannel heat sinks. In Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007 (pp. 54-59). [4451746] (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC). https://doi.org/10.1109/THERMINIC.2007.4451746