Numerical study of MicroChannel liquid cooling under uniform and non-uniform heating conditions

Ling Ling, Yanfeng Fan, Ibrahim Hassan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

MicroChannel heat sink is a promising cooling technology for semiconductor devices with a high cooling capacity and low mass flow rate requirement. Nowadays, semiconductor devices are widely used in industry and improved in size and clock speed which leads to higher heat flux. In this paper, three kinds of microchannel heat sink designs are proposed and the cooling performance is investigated by CFD. Uniform heating condition is applied to the swirl microchannel heat sink. The non-uniform heating condition is divided into local high heat flux and continuously varying heat flux to simulate the electrical devices and concentrated photovoltaic cell, respectively. The cross-linked microchannel heat sink and hybrid micro heat sink are used to remove the local high heat flux. Two different sizes and numbers of hotspots are designed and applied to these two heat sinks. The straight microchannel heat sink is designed for continuously varying heat flux. Water is used as coolant and copper / silicon is selected as heat sink material. The heat flux varies from 10 W/cm2 to 100 W/cm'. The inlet velocity varies from 0.5 m/s to 1 m/s. The maximum temperature, temperature gradient, pressure drop and total thermal resistance are chosen to be criterion of evaluating their cooling performance.

Original languageEnglish
Title of host publicationIMETI 2011 - 4th International Multi-Conference on Engineering and Technological Innovation, Proceedings
Pages39-42
Number of pages4
Volume1
Publication statusPublished - 2011
Externally publishedYes
Event4th International Multi-Conference on Engineering and Technological Innovation, IMETI 2011 - Orlando, FL, United States
Duration: 19 Jul 201122 Jul 2011

Other

Other4th International Multi-Conference on Engineering and Technological Innovation, IMETI 2011
CountryUnited States
CityOrlando, FL
Period19/7/1122/7/11

Fingerprint

Heat sinks
Microchannels
Cooling
Heat flux
Heating
Liquids
Semiconductor devices
Photovoltaic cells
Heat resistance
Coolants
Thermal gradients
Pressure drop
Clocks
Computational fluid dynamics
Flow rate
Copper
Silicon
Temperature
Semiconductors

Keywords

  • CFD
  • Cross-linked channel
  • Microchannel heat sink
  • Straight channel
  • Swirl channel
  • Uniform and non-uniform heating

ASJC Scopus subject areas

  • Management of Technology and Innovation
  • Engineering(all)

Cite this

Ling, L., Fan, Y., & Hassan, I. (2011). Numerical study of MicroChannel liquid cooling under uniform and non-uniform heating conditions. In IMETI 2011 - 4th International Multi-Conference on Engineering and Technological Innovation, Proceedings (Vol. 1, pp. 39-42)

Numerical study of MicroChannel liquid cooling under uniform and non-uniform heating conditions. / Ling, Ling; Fan, Yanfeng; Hassan, Ibrahim.

IMETI 2011 - 4th International Multi-Conference on Engineering and Technological Innovation, Proceedings. Vol. 1 2011. p. 39-42.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ling, L, Fan, Y & Hassan, I 2011, Numerical study of MicroChannel liquid cooling under uniform and non-uniform heating conditions. in IMETI 2011 - 4th International Multi-Conference on Engineering and Technological Innovation, Proceedings. vol. 1, pp. 39-42, 4th International Multi-Conference on Engineering and Technological Innovation, IMETI 2011, Orlando, FL, United States, 19/7/11.
Ling L, Fan Y, Hassan I. Numerical study of MicroChannel liquid cooling under uniform and non-uniform heating conditions. In IMETI 2011 - 4th International Multi-Conference on Engineering and Technological Innovation, Proceedings. Vol. 1. 2011. p. 39-42
Ling, Ling ; Fan, Yanfeng ; Hassan, Ibrahim. / Numerical study of MicroChannel liquid cooling under uniform and non-uniform heating conditions. IMETI 2011 - 4th International Multi-Conference on Engineering and Technological Innovation, Proceedings. Vol. 1 2011. pp. 39-42
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