Numerical study of microchannel heat sinks with non-uniform heat flux conditions

Ling Ling, Yanfeng Fan, Ibrahim Hassan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Higher heat flux is produced by Micro-Electro-Mechanical Systems (MEMS) because of their reduced size and increased clock speed. At the mean time, studies of non-uniform heating conditions which are more practical than uniform heating conditions are inadequate and needed urgently. Four nonuniform heating conditions are simulated in the paper. Three heat sinks with different widths of cross-linked channels locating above the center of hotspots are studied and compared to conventional straight microchannel heat sink. Half of the module geometry is chosen to be the computational domain. Two hotspots are placed at the bottom surface. The coolant is water, whose properties are dependent on temperature. Two inlet velocities, 0.5 m/s and 1 m/s, are tested for each heat sink. Temperature profile at the hotspots, pressure drop and total thermal resistance are selected as criteria of evaluating heat sink performance. All heat sinks have better performance when there is an upstream hotspot or the upstream hotspot is subjected to a higher heat flux. Cross-linked channel width of 0.5 mm has the best benefit to obtain better temperature uniformity without increasing the maximum temperature on the bottom surface.

Original languageEnglish
Title of host publicationASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011
Pages87-93
Number of pages7
Volume2
DOIs
Publication statusPublished - 2011
Externally publishedYes
EventASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011 - Edmonton, AB, Canada
Duration: 19 Jun 201122 Jun 2011

Other

OtherASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011
CountryCanada
CityEdmonton, AB
Period19/6/1122/6/11

Fingerprint

Heat sinks
Microchannels
Heat flux
Heating
Temperature
Time and motion study
Heat resistance
Coolants
Pressure drop
Clocks
Geometry
Water

ASJC Scopus subject areas

  • Process Chemistry and Technology

Cite this

Ling, L., Fan, Y., & Hassan, I. (2011). Numerical study of microchannel heat sinks with non-uniform heat flux conditions. In ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011 (Vol. 2, pp. 87-93) https://doi.org/10.1115/ICNMM2011-58179

Numerical study of microchannel heat sinks with non-uniform heat flux conditions. / Ling, Ling; Fan, Yanfeng; Hassan, Ibrahim.

ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. Vol. 2 2011. p. 87-93.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ling, L, Fan, Y & Hassan, I 2011, Numerical study of microchannel heat sinks with non-uniform heat flux conditions. in ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. vol. 2, pp. 87-93, ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011, Edmonton, AB, Canada, 19/6/11. https://doi.org/10.1115/ICNMM2011-58179
Ling L, Fan Y, Hassan I. Numerical study of microchannel heat sinks with non-uniform heat flux conditions. In ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. Vol. 2. 2011. p. 87-93 https://doi.org/10.1115/ICNMM2011-58179
Ling, Ling ; Fan, Yanfeng ; Hassan, Ibrahim. / Numerical study of microchannel heat sinks with non-uniform heat flux conditions. ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. Vol. 2 2011. pp. 87-93
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