Numerical simulation of residual stresses in diamond coating on Ti-6Al-4V substrate

Z. Nibennaoune, D. George, S. Ahzi, D. Ruch, Y. Remond, J. J. Gracio

Research output: Contribution to journalArticle

9 Citations (Scopus)


In this paper, we present numerical simulations of the residual stresses developed between diamond coatings and Ti-6Al-4V substrates when using chemical vapour deposition technique. The large difference in thermal expansion coefficients of diamond and titanium alloys results in high residual stresses in the diamond film. This could lead to interfacial cracking and material failure. The finite element method was used to simulate the cooling process of diamond films at various thicknesses and deposited at temperatures ranging from 600 °C to 900 °C. The influence of different parameters such as temperature, film thickness, material characteristics, geometry and edge effects are investigated for different case geometries. The film debonding and cracking is discussed and numerical results are compared with existing experimental and numerical results. Finally, some propositions are made to enhance the experimental process in order to reduce the residual stress intensities and the possible material degradation.

Original languageEnglish
Pages (from-to)3260-3266
Number of pages7
JournalThin Solid Films
Issue number12
Publication statusPublished - 2 Apr 2010


  • Diamond film
  • Finite element analysis
  • Residual stress
  • Titanium alloy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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