Novel structure of carbon nanotube micro electrode for high-resolution stimulation of neurons

Hua Xu, Leanne L.H. Chan, Amine Bermak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper proposes a novel method to fabricate high resolution flexible electrodes. Among the steps, the carbon nanotube (CNT) electrodes synthesized facing down shows impedance improvement of about 90 times comparing with the normal facing up synthesized samples. Meanwhile, section impedance of electrodes is also defined in this paper to compare the area efficiency of impedance between electrodes with different sizes. In addition and to the best of our knowledge, high performance electrodes embedded inside parylene is reported for the first time taking into consideration the hydrophobicity change of the CNT surface.

Original languageEnglish
Title of host publication2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages6170-6173
Number of pages4
Volume2016-October
ISBN (Electronic)9781457702204
DOIs
Publication statusPublished - 13 Oct 2016
Event38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016 - Orlando, United States
Duration: 16 Aug 201620 Aug 2016

Other

Other38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016
CountryUnited States
CityOrlando
Period16/8/1620/8/16

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ASJC Scopus subject areas

  • Signal Processing
  • Biomedical Engineering
  • Computer Vision and Pattern Recognition
  • Health Informatics

Cite this

Xu, H., Chan, L. L. H., & Bermak, A. (2016). Novel structure of carbon nanotube micro electrode for high-resolution stimulation of neurons. In 2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2016 (Vol. 2016-October, pp. 6170-6173). [7592137] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMBC.2016.7592137