Microstructure of the pure copper produced by upsetting with ultrasonic vibration

Yanxiong Liu, Sergey Suslov, Qingyou Han, Clause Xu, Lin Hua

Research output: Contribution to journalArticle

43 Citations (Scopus)

Abstract

The propagation of the ultrasonic wave in the solids can greatly affect the microstructure of the material. In this paper, upsetting with ultrasonic vibration as a novel method to produce the ultrafine grained material was presented to refine the pure copper grains. For the ultrasonic vibration upsetting, during the upsetting process, the ultrasonic wave propagates in the specimen at the same time. Under the coupling action of the ultrasonic and plastic deformation, the pure copper grains with the initial grain size of ∼ 50 μm? were refined to about 100-300 nm after one time forming process. By comparing the ultrasonic vibration upsetting with the conventional upsetting process, the role that the ultrasonic wave played during the upsetting process was revealed.

Original languageEnglish
Pages (from-to)52-55
Number of pages4
JournalMaterials Letters
Volume67
Issue number1
DOIs
Publication statusPublished - 15 Jan 2012
Externally publishedYes

Fingerprint

upsetting
Vibrations (mechanical)
Copper
Ultrasonic waves
ultrasonics
Ultrasonics
copper
vibration
microstructure
Microstructure
ultrasonic radiation
Plastic deformation
plastic deformation
grain size
propagation

Keywords

  • Grain refinement
  • Nanostructured material
  • Severe plastic deformation (SPD)
  • Upsetting with ultrasonic vibration (UUV)

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Microstructure of the pure copper produced by upsetting with ultrasonic vibration. / Liu, Yanxiong; Suslov, Sergey; Han, Qingyou; Xu, Clause; Hua, Lin.

In: Materials Letters, Vol. 67, No. 1, 15.01.2012, p. 52-55.

Research output: Contribution to journalArticle

Liu, Yanxiong ; Suslov, Sergey ; Han, Qingyou ; Xu, Clause ; Hua, Lin. / Microstructure of the pure copper produced by upsetting with ultrasonic vibration. In: Materials Letters. 2012 ; Vol. 67, No. 1. pp. 52-55.
@article{d4b102561aa7461bbe7e8d1c20ccdaf6,
title = "Microstructure of the pure copper produced by upsetting with ultrasonic vibration",
abstract = "The propagation of the ultrasonic wave in the solids can greatly affect the microstructure of the material. In this paper, upsetting with ultrasonic vibration as a novel method to produce the ultrafine grained material was presented to refine the pure copper grains. For the ultrasonic vibration upsetting, during the upsetting process, the ultrasonic wave propagates in the specimen at the same time. Under the coupling action of the ultrasonic and plastic deformation, the pure copper grains with the initial grain size of ∼ 50 μm? were refined to about 100-300 nm after one time forming process. By comparing the ultrasonic vibration upsetting with the conventional upsetting process, the role that the ultrasonic wave played during the upsetting process was revealed.",
keywords = "Grain refinement, Nanostructured material, Severe plastic deformation (SPD), Upsetting with ultrasonic vibration (UUV)",
author = "Yanxiong Liu and Sergey Suslov and Qingyou Han and Clause Xu and Lin Hua",
year = "2012",
month = "1",
day = "15",
doi = "10.1016/j.matlet.2011.08.086",
language = "English",
volume = "67",
pages = "52--55",
journal = "Materials Letters",
issn = "0167-577X",
publisher = "Elsevier",
number = "1",

}

TY - JOUR

T1 - Microstructure of the pure copper produced by upsetting with ultrasonic vibration

AU - Liu, Yanxiong

AU - Suslov, Sergey

AU - Han, Qingyou

AU - Xu, Clause

AU - Hua, Lin

PY - 2012/1/15

Y1 - 2012/1/15

N2 - The propagation of the ultrasonic wave in the solids can greatly affect the microstructure of the material. In this paper, upsetting with ultrasonic vibration as a novel method to produce the ultrafine grained material was presented to refine the pure copper grains. For the ultrasonic vibration upsetting, during the upsetting process, the ultrasonic wave propagates in the specimen at the same time. Under the coupling action of the ultrasonic and plastic deformation, the pure copper grains with the initial grain size of ∼ 50 μm? were refined to about 100-300 nm after one time forming process. By comparing the ultrasonic vibration upsetting with the conventional upsetting process, the role that the ultrasonic wave played during the upsetting process was revealed.

AB - The propagation of the ultrasonic wave in the solids can greatly affect the microstructure of the material. In this paper, upsetting with ultrasonic vibration as a novel method to produce the ultrafine grained material was presented to refine the pure copper grains. For the ultrasonic vibration upsetting, during the upsetting process, the ultrasonic wave propagates in the specimen at the same time. Under the coupling action of the ultrasonic and plastic deformation, the pure copper grains with the initial grain size of ∼ 50 μm? were refined to about 100-300 nm after one time forming process. By comparing the ultrasonic vibration upsetting with the conventional upsetting process, the role that the ultrasonic wave played during the upsetting process was revealed.

KW - Grain refinement

KW - Nanostructured material

KW - Severe plastic deformation (SPD)

KW - Upsetting with ultrasonic vibration (UUV)

UR - http://www.scopus.com/inward/record.url?scp=80053520437&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80053520437&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2011.08.086

DO - 10.1016/j.matlet.2011.08.086

M3 - Article

AN - SCOPUS:80053520437

VL - 67

SP - 52

EP - 55

JO - Materials Letters

JF - Materials Letters

SN - 0167-577X

IS - 1

ER -