Microstructure and mechanical properties of copper subjected to cryogenic laser shock peening

Chang Ye, Sergey Suslov, Dong Lin, Yiliang Liao, Xueling Fei, Gary J. Cheng

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

In this study, an innovative materials processing technique, cryogenic laser shock peening (CLSP), is investigated. Copper is processed by laser shock peening (LSP) at the cryogenic temperature and compared with LSP at room temperature (RT-LSP). The microstructure of copper after processing is characterized by transmission electron microscopy (TEM). Nanotwins were observed in copper after CLSP due to the effect of cryogenic temperature. In addition, more energy is stored in the material as defects (dislocations) by CLSP compared to RT-LSP. Because of these unique microstructure changes, it is found that high material strength with good thermal stability is achieved after CLSP. The mechanical properties after CLSP, RT-LSP, and as-received are compared.

Original languageEnglish
Article number083504
JournalJournal of Applied Physics
Volume110
Issue number8
DOIs
Publication statusPublished - 15 Oct 2011
Externally publishedYes

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peening
cryogenics
shock
mechanical properties
copper
microstructure
lasers
cryogenic temperature
thermal stability

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Microstructure and mechanical properties of copper subjected to cryogenic laser shock peening. / Ye, Chang; Suslov, Sergey; Lin, Dong; Liao, Yiliang; Fei, Xueling; Cheng, Gary J.

In: Journal of Applied Physics, Vol. 110, No. 8, 083504, 15.10.2011.

Research output: Contribution to journalArticle

Ye, Chang ; Suslov, Sergey ; Lin, Dong ; Liao, Yiliang ; Fei, Xueling ; Cheng, Gary J. / Microstructure and mechanical properties of copper subjected to cryogenic laser shock peening. In: Journal of Applied Physics. 2011 ; Vol. 110, No. 8.
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