Microchannel heat sinks

An overview of the state-of-the-art

Ibrahim Hassan, P. Phutthavong, M. Abdelgawad

Research output: Contribution to journalReview article

99 Citations (Scopus)

Abstract

Computers are rapidly becoming faster and more versatile, and as a result, high-powered integrated circuits have been produced in order to meet this need. However, these high-speed circuits are expected to generate heat fluxes that exceed the circuit's allowable operating temperature, and so an innovative cooling device is needed to solve this problem. Microchannel heat sinks were introduced in the early 1980s to be used as a means of cooling integrated circuits. Since then, many studies have been conducted in the field of these microchannel heat sinks. Earlier research used mainly single-phase coolants in their heat sinks, but two-phase coolants are now the focus of more recent research. The purpose of this article is to present a state-of-the art literature review of the progress of research in the field of microchannel heat sinks. This literature will focus mainly on the most recent research, starting with the latter half of the 1990s.

Original languageEnglish
Pages (from-to)183-205
Number of pages23
JournalMicroscale Thermophysical Engineering
Volume8
Issue number3
DOIs
Publication statusPublished - Jul 2004
Externally publishedYes

Fingerprint

heat sinks
Heat sinks
microchannels
Microchannels
coolants
Coolants
integrated circuits
Integrated circuits
Cooling
cooling
Networks (circuits)
operating temperature
Heat flux
heat flux
high speed
Temperature

Keywords

  • Integrated circuits cooling
  • Literature review
  • Microchannel heat sinks

ASJC Scopus subject areas

  • Mechanical Engineering
  • Materials Science (miscellaneous)
  • Physics and Astronomy (miscellaneous)

Cite this

Microchannel heat sinks : An overview of the state-of-the-art. / Hassan, Ibrahim; Phutthavong, P.; Abdelgawad, M.

In: Microscale Thermophysical Engineering, Vol. 8, No. 3, 07.2004, p. 183-205.

Research output: Contribution to journalReview article

Hassan, Ibrahim ; Phutthavong, P. ; Abdelgawad, M. / Microchannel heat sinks : An overview of the state-of-the-art. In: Microscale Thermophysical Engineering. 2004 ; Vol. 8, No. 3. pp. 183-205.
@article{98330e33dfa64f5d81fc0cba96b7b9b4,
title = "Microchannel heat sinks: An overview of the state-of-the-art",
abstract = "Computers are rapidly becoming faster and more versatile, and as a result, high-powered integrated circuits have been produced in order to meet this need. However, these high-speed circuits are expected to generate heat fluxes that exceed the circuit's allowable operating temperature, and so an innovative cooling device is needed to solve this problem. Microchannel heat sinks were introduced in the early 1980s to be used as a means of cooling integrated circuits. Since then, many studies have been conducted in the field of these microchannel heat sinks. Earlier research used mainly single-phase coolants in their heat sinks, but two-phase coolants are now the focus of more recent research. The purpose of this article is to present a state-of-the art literature review of the progress of research in the field of microchannel heat sinks. This literature will focus mainly on the most recent research, starting with the latter half of the 1990s.",
keywords = "Integrated circuits cooling, Literature review, Microchannel heat sinks",
author = "Ibrahim Hassan and P. Phutthavong and M. Abdelgawad",
year = "2004",
month = "7",
doi = "10.1080/10893950490477338",
language = "English",
volume = "8",
pages = "183--205",
journal = "Nanoscale and Microscale Thermophysical Engineering",
issn = "1556-7265",
publisher = "Taylor and Francis Ltd.",
number = "3",

}

TY - JOUR

T1 - Microchannel heat sinks

T2 - An overview of the state-of-the-art

AU - Hassan, Ibrahim

AU - Phutthavong, P.

AU - Abdelgawad, M.

PY - 2004/7

Y1 - 2004/7

N2 - Computers are rapidly becoming faster and more versatile, and as a result, high-powered integrated circuits have been produced in order to meet this need. However, these high-speed circuits are expected to generate heat fluxes that exceed the circuit's allowable operating temperature, and so an innovative cooling device is needed to solve this problem. Microchannel heat sinks were introduced in the early 1980s to be used as a means of cooling integrated circuits. Since then, many studies have been conducted in the field of these microchannel heat sinks. Earlier research used mainly single-phase coolants in their heat sinks, but two-phase coolants are now the focus of more recent research. The purpose of this article is to present a state-of-the art literature review of the progress of research in the field of microchannel heat sinks. This literature will focus mainly on the most recent research, starting with the latter half of the 1990s.

AB - Computers are rapidly becoming faster and more versatile, and as a result, high-powered integrated circuits have been produced in order to meet this need. However, these high-speed circuits are expected to generate heat fluxes that exceed the circuit's allowable operating temperature, and so an innovative cooling device is needed to solve this problem. Microchannel heat sinks were introduced in the early 1980s to be used as a means of cooling integrated circuits. Since then, many studies have been conducted in the field of these microchannel heat sinks. Earlier research used mainly single-phase coolants in their heat sinks, but two-phase coolants are now the focus of more recent research. The purpose of this article is to present a state-of-the art literature review of the progress of research in the field of microchannel heat sinks. This literature will focus mainly on the most recent research, starting with the latter half of the 1990s.

KW - Integrated circuits cooling

KW - Literature review

KW - Microchannel heat sinks

UR - http://www.scopus.com/inward/record.url?scp=4444272696&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=4444272696&partnerID=8YFLogxK

U2 - 10.1080/10893950490477338

DO - 10.1080/10893950490477338

M3 - Review article

VL - 8

SP - 183

EP - 205

JO - Nanoscale and Microscale Thermophysical Engineering

JF - Nanoscale and Microscale Thermophysical Engineering

SN - 1556-7265

IS - 3

ER -