Low dielectric constant mesoporous silica films through molecularly templated synthesis

Suresh Baskaran, Jun Liu, Karel Domansky, Nathan Kohler, Xiahong Li, Christopher Coyle, Glen E. Fryxell, Suntharampillai Thevuthasan, Ralph E. Williford

Research output: Contribution to journalArticle

243 Citations (Scopus)

Abstract

Low dielectric constant mesoporous silica films with pore sizes of less than ≈5 nm were synthesized using spin coating approach. Dielectric constant of ≈1.8 to ≈2.5 were obtained in spin coated films prepared using a surfactant to template the nanometer-scale porosity. The dielectric properties of the films were correlated with surface chemistry, characterized by X-ray photoelectron spectroscopy. The surface texture, thickness, and elastic modulus of the films indicated potential for integration in semiconductor interconnects.

Original languageEnglish
Pages (from-to)291-294
Number of pages4
JournalAdvanced Materials
Volume12
Issue number4
Publication statusPublished - 2000
Externally publishedYes

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ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Baskaran, S., Liu, J., Domansky, K., Kohler, N., Li, X., Coyle, C., Fryxell, G. E., Thevuthasan, S., & Williford, R. E. (2000). Low dielectric constant mesoporous silica films through molecularly templated synthesis. Advanced Materials, 12(4), 291-294.