Low dielectric constant mesoporous silica films with pore sizes of less than ≈5 nm were synthesized using spin coating approach. Dielectric constant of ≈1.8 to ≈2.5 were obtained in spin coated films prepared using a surfactant to template the nanometer-scale porosity. The dielectric properties of the films were correlated with surface chemistry, characterized by X-ray photoelectron spectroscopy. The surface texture, thickness, and elastic modulus of the films indicated potential for integration in semiconductor interconnects.
|Number of pages||4|
|Publication status||Published - 2000|
ASJC Scopus subject areas
- Materials Science(all)