Investigation of cooling performance of a swirl microchannel heat sink by numerical simulation

Yanfeng Fan, Ibrahim Hassan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High heat fluxes have been created by the semiconductor devices due to the high power generation and shrank size. The large heat flux causes the circuit to exceed its allowable temperature and may experience both working efficiency loss and irreversible damage due to excess in their temperatures. In this paper, a swirl microchannel heat sink is designed to dissipate the large heat flux from the devices. The numerical simulation is carried out to investigate the cooling performance. Uniform heating boundary condition is applied and single phase water is selected as coolant. The present micro heat sink applies multiple swirl microchannels positioned in a circular flat plate to enhance the heat convection by creating the secondary flow at high Reynolds numbers. Copper is selected as the material of heat sink. The channel depth and width are fixed as 0.5 mm and 0.4 mm, respectively. The heat is injected into the system from the bottom of heat sink at the heat fluxes from 10 to 60 W/cm2. Flow is supplied from the top of micro heat sink through a jet hole with a diameter of 2 mm and enters swirl microchannels at the volume flow rates varying from 47 to 188 ml/min. The cooling performances of swirl microchannel heat sinks with different curvatures and channel numbers are evaluated based on the targets of low maximum temperature, temperature gradient and pressure drop.

Original languageEnglish
Title of host publicationASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011
Pages463-469
Number of pages7
Volume1
DOIs
Publication statusPublished - 2011
Externally publishedYes
EventASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011 - Edmonton, AB, Canada
Duration: 19 Jun 201122 Jun 2011

Other

OtherASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011
CountryCanada
CityEdmonton, AB
Period19/6/1122/6/11

Fingerprint

Heat sinks
Microchannels
Cooling
Heat flux
Computer simulation
Heat convection
Secondary flow
Semiconductor devices
Coolants
Thermal gradients
Temperature
Pressure drop
Power generation
Copper
Reynolds number
Flow rate
Boundary conditions
Heating
Water
Networks (circuits)

ASJC Scopus subject areas

  • Process Chemistry and Technology

Cite this

Fan, Y., & Hassan, I. (2011). Investigation of cooling performance of a swirl microchannel heat sink by numerical simulation. In ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011 (Vol. 1, pp. 463-469) https://doi.org/10.1115/ICNMM2011-58038

Investigation of cooling performance of a swirl microchannel heat sink by numerical simulation. / Fan, Yanfeng; Hassan, Ibrahim.

ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. Vol. 1 2011. p. 463-469.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fan, Y & Hassan, I 2011, Investigation of cooling performance of a swirl microchannel heat sink by numerical simulation. in ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. vol. 1, pp. 463-469, ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011, Edmonton, AB, Canada, 19/6/11. https://doi.org/10.1115/ICNMM2011-58038
Fan Y, Hassan I. Investigation of cooling performance of a swirl microchannel heat sink by numerical simulation. In ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. Vol. 1. 2011. p. 463-469 https://doi.org/10.1115/ICNMM2011-58038
Fan, Yanfeng ; Hassan, Ibrahim. / Investigation of cooling performance of a swirl microchannel heat sink by numerical simulation. ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011. Vol. 1 2011. pp. 463-469
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