Interfacial shear strength of oxide scale and SS 441 substrate

Wenning Liu, Xin Sun, Elizabeth Stephens, Moe Khaleel

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Recent developments on decreasing the operating temperature for solid oxide fuel cells (SOFCs) have enabled the use of high-temperature ferritic alloys as interconnect materials. Oxide scale will inevitably grow on the ferritic interconnects in a high-temperature oxidation environment of SOFCs. The growth of the oxide scale induces growth stresses in the scale layer and on the scale/substrate interface. These growth stresses combined with the thermal stresses induced after stacking cooling by the thermal expansion coefficient mismatch between the oxide scale and the substrate may lead to scale delamination/buckling and eventual spallation, which may lead to serious cell performance degradation. Hence, the interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. In this article, we applied an integrated experimental/modeling methodology to quantify the interfacial adhesion strength between the oxide scale and the SS 441 metallic interconnect. The predicted interfacial strength is discussed in detail.

Original languageEnglish
Pages (from-to)1222-1228
Number of pages7
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume42
Issue number5
DOIs
Publication statusPublished - 1 May 2011
Externally publishedYes

Fingerprint

shear strength
Shear strength
Oxides
Solid oxide fuel cells (SOFC)
oxides
Substrates
Bond strength (materials)
solid oxide fuel cells
Thermooxidation
adhesion
combined stress
Delamination
Thermal stress
Buckling
Thermal expansion
Durability
Cooling
spallation
buckling
thermal stresses

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Metals and Alloys
  • Mechanics of Materials

Cite this

Interfacial shear strength of oxide scale and SS 441 substrate. / Liu, Wenning; Sun, Xin; Stephens, Elizabeth; Khaleel, Moe.

In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 42, No. 5, 01.05.2011, p. 1222-1228.

Research output: Contribution to journalArticle

Liu, Wenning ; Sun, Xin ; Stephens, Elizabeth ; Khaleel, Moe. / Interfacial shear strength of oxide scale and SS 441 substrate. In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 2011 ; Vol. 42, No. 5. pp. 1222-1228.
@article{be61893b681e47e4a75ac767c4fd808f,
title = "Interfacial shear strength of oxide scale and SS 441 substrate",
abstract = "Recent developments on decreasing the operating temperature for solid oxide fuel cells (SOFCs) have enabled the use of high-temperature ferritic alloys as interconnect materials. Oxide scale will inevitably grow on the ferritic interconnects in a high-temperature oxidation environment of SOFCs. The growth of the oxide scale induces growth stresses in the scale layer and on the scale/substrate interface. These growth stresses combined with the thermal stresses induced after stacking cooling by the thermal expansion coefficient mismatch between the oxide scale and the substrate may lead to scale delamination/buckling and eventual spallation, which may lead to serious cell performance degradation. Hence, the interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. In this article, we applied an integrated experimental/modeling methodology to quantify the interfacial adhesion strength between the oxide scale and the SS 441 metallic interconnect. The predicted interfacial strength is discussed in detail.",
author = "Wenning Liu and Xin Sun and Elizabeth Stephens and Moe Khaleel",
year = "2011",
month = "5",
day = "1",
doi = "10.1007/s11661-010-0537-3",
language = "English",
volume = "42",
pages = "1222--1228",
journal = "Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science",
issn = "1073-5623",
publisher = "Springer Boston",
number = "5",

}

TY - JOUR

T1 - Interfacial shear strength of oxide scale and SS 441 substrate

AU - Liu, Wenning

AU - Sun, Xin

AU - Stephens, Elizabeth

AU - Khaleel, Moe

PY - 2011/5/1

Y1 - 2011/5/1

N2 - Recent developments on decreasing the operating temperature for solid oxide fuel cells (SOFCs) have enabled the use of high-temperature ferritic alloys as interconnect materials. Oxide scale will inevitably grow on the ferritic interconnects in a high-temperature oxidation environment of SOFCs. The growth of the oxide scale induces growth stresses in the scale layer and on the scale/substrate interface. These growth stresses combined with the thermal stresses induced after stacking cooling by the thermal expansion coefficient mismatch between the oxide scale and the substrate may lead to scale delamination/buckling and eventual spallation, which may lead to serious cell performance degradation. Hence, the interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. In this article, we applied an integrated experimental/modeling methodology to quantify the interfacial adhesion strength between the oxide scale and the SS 441 metallic interconnect. The predicted interfacial strength is discussed in detail.

AB - Recent developments on decreasing the operating temperature for solid oxide fuel cells (SOFCs) have enabled the use of high-temperature ferritic alloys as interconnect materials. Oxide scale will inevitably grow on the ferritic interconnects in a high-temperature oxidation environment of SOFCs. The growth of the oxide scale induces growth stresses in the scale layer and on the scale/substrate interface. These growth stresses combined with the thermal stresses induced after stacking cooling by the thermal expansion coefficient mismatch between the oxide scale and the substrate may lead to scale delamination/buckling and eventual spallation, which may lead to serious cell performance degradation. Hence, the interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. In this article, we applied an integrated experimental/modeling methodology to quantify the interfacial adhesion strength between the oxide scale and the SS 441 metallic interconnect. The predicted interfacial strength is discussed in detail.

UR - http://www.scopus.com/inward/record.url?scp=79954437955&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79954437955&partnerID=8YFLogxK

U2 - 10.1007/s11661-010-0537-3

DO - 10.1007/s11661-010-0537-3

M3 - Article

VL - 42

SP - 1222

EP - 1228

JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

SN - 1073-5623

IS - 5

ER -