Interface attachability analysis of printed patterns through electrostatic inkjet system

Adnan Ali, A. Rahman, K. H. Choi, B. S. Yang, D. S. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The paper focuses on attachability of printed lines through non contact electrostatic inkjet printing on different substrates using silver based conductive ink. Inktec TEC-IJ-040 conductive ink containing 20%wt of metallic pigments were used. The ink is forced through a small orifice by the help of electrostatic forces. Thus, the droplets formed impact on the substrate. Conductive droplets were printed on different substrates (PET, Inkjet photo paper, Poly (vinylcinnamate), OHP and ITO). Attachability of these droplets have been investigated by using adhesion test after curing at room temperature. For a more detailed investigation of attach ability, interface of the resultant printed lines were studied to analyze the nature of bonding between droplets and substrate. The study of compatibility of different substrates with conductive inks was undertaken. From this study, the life and stability of the conductive line on different substrates were evaluated. This research study will help to improve and optimize the properties of the ink and substrate combination.

Original languageEnglish
Title of host publicationInnovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping
Pages377-380
Number of pages4
Publication statusPublished - 2010
Externally publishedYes
Event4th International Conference on Advanced Research in Virtual and Physical Prototyping, VRAP 2009 - Leiria, Portugal
Duration: 6 Oct 200910 Oct 2009

Other

Other4th International Conference on Advanced Research in Virtual and Physical Prototyping, VRAP 2009
CountryPortugal
CityLeiria
Period6/10/0910/10/09

Fingerprint

Electrostatics
Ink
Substrates
Electrostatic printing
Electrostatic force
Orifices
Pigments
Curing
Silver
Adhesion
Temperature

ASJC Scopus subject areas

  • Artificial Intelligence
  • Software

Cite this

Ali, A., Rahman, A., Choi, K. H., Yang, B. S., & Kim, D. S. (2010). Interface attachability analysis of printed patterns through electrostatic inkjet system. In Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping (pp. 377-380)

Interface attachability analysis of printed patterns through electrostatic inkjet system. / Ali, Adnan; Rahman, A.; Choi, K. H.; Yang, B. S.; Kim, D. S.

Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping. 2010. p. 377-380.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ali, A, Rahman, A, Choi, KH, Yang, BS & Kim, DS 2010, Interface attachability analysis of printed patterns through electrostatic inkjet system. in Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping. pp. 377-380, 4th International Conference on Advanced Research in Virtual and Physical Prototyping, VRAP 2009, Leiria, Portugal, 6/10/09.
Ali A, Rahman A, Choi KH, Yang BS, Kim DS. Interface attachability analysis of printed patterns through electrostatic inkjet system. In Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping. 2010. p. 377-380
Ali, Adnan ; Rahman, A. ; Choi, K. H. ; Yang, B. S. ; Kim, D. S. / Interface attachability analysis of printed patterns through electrostatic inkjet system. Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping. 2010. pp. 377-380
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