Identification of the dynamic behavior of epoxy material at large strain over a wide range of temperatures

C. A. Bernard, N. Bahlouli, D. George, Y. Rémond, S. Ahzi

Research output: Contribution to journalArticle

Abstract

Adhesively bonded joints using epoxy resin are nowadays often replacing welding in offshore applications for safety reasons. During its lifetime, the bonded joint epoxy is submitted to severe environmental and loading conditions, such as humidity, water uptake, thermal aging, and complex loading conditions affecting its mechanical performance. We investigate here the dynamic mechanical behavior of an epoxy resin at large strain over a wide range of temperatures. Analysis of the elastic modulus, yield strain, yield stress and plastic flow as a function of the temperature and strain rate is carried out. Unlike the elastic modulus and the yield stress showing strong sensitivities to the temperature and the strain rate, the plastic flow appears to have a limited sensitivity to the temperature and the strain rate. Numerical modeling is used to determine the yield stress and elastic modulus variations over the glass transition temperature and good agreement is observed between numerical predictions and experimental results.

Original languageEnglish
Article number103323
JournalMechanics of Materials
Volume143
DOIs
Publication statusPublished - Apr 2020

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Keywords

  • Dynamic behavior
  • Elastic modulus
  • Epoxy
  • SHPB
  • Strain rate
  • Temperature
  • Yield stress

ASJC Scopus subject areas

  • Materials Science(all)
  • Instrumentation
  • Mechanics of Materials

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