Flow and heat transfer in a cross-linked silicon microchannel heat sink

R. Muwanga, Ibrahim Hassan

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

This paper presents the flow and heat transfer characteristics in a cross-linked silicon microchannel heat sink. The heat sink is composed of 45 channels, 269 μm wide × 283 μm tall, in a silicon substrate formed via deep reactive ion etching. A detailed discussion of the pressure drop data reduction is described, including characterization of the channel cross sections and methods to account for inlet and exit loss coefficients. No significant difference is observed in the pressure drop measurements between the cross-linked and standard heat sinks flowing air and water. The use of unencapsulated liquid crystal thermography was successfully used to obtain local heat transfer data with FC-72 as the working fluid. The heat transfer results show inflections in the thermal profile due to the cross links.

Original languageEnglish
Pages (from-to)333-341
Number of pages9
JournalJournal of Thermophysics and Heat Transfer
Volume22
Issue number3
DOIs
Publication statusPublished - Jul 2008
Externally publishedYes

Fingerprint

heat sinks
Heat sinks
Silicon
microchannels
Microchannels
heat transfer
Heat transfer
pressure drop
Pressure drop
silicon
working fluids
Reactive ion etching
data reduction
Data reduction
liquid crystals
etching
Fluids
Water
air
cross sections

ASJC Scopus subject areas

  • Mechanical Engineering
  • Physical and Theoretical Chemistry
  • Fluid Flow and Transfer Processes

Cite this

Flow and heat transfer in a cross-linked silicon microchannel heat sink. / Muwanga, R.; Hassan, Ibrahim.

In: Journal of Thermophysics and Heat Transfer, Vol. 22, No. 3, 07.2008, p. 333-341.

Research output: Contribution to journalArticle

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