Evolution of microstructure and microtexture in a Cu/Ta multilayer during accumulative roll-bonding at high temperature

Tarang Mungole, Bilal Mansoor, Georges Ayoub, David P. Field

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

There have been limited studies on both the microstructure and microtexture evolution during accumulative roll-bonding (ARB) of dissimilar metals. In the current investigation, a Cu/Ta multilayered system is fabricated by processing annealed Cu and Ta plates for up to 8 ARB passes at 673 K. The ARB-processed samples consisted of 2,4, 8,16,32 and 256 layers with an individual layer thicknesses close to ∼ 200, 100, 50, 25, 12.5 and 1.56 μm, respectively. Significant grain refinement was observed, with smallest grain sizes of ∼ 200 nm in Cu and ∼ 500 nm in Ta, after 8 ARB passes. Cu layers showed prominent C {001}<110> shear component after ARB processing and low ideal rolling components for fee metals. Whereas, Ta layers showed high intensities of {111}<112> and {001}<110> components after 5 ARB passes, depicting development of rolling texture and a recrystallized microstructure. Eventually, the texture in both Cu and Ta was stabilized after 8 ARB passes, with very low intensities of all ideal orientations, except for Goss orientation {110}<001> in Ta, showing the effect of nucleation of grains in shear bands. Thus, it can be summarized that Cu mainly deforms with shear whereas Ta mainly undergoes plane strain deformation when they are deformed together.

Original languageEnglish
Title of host publicationMaterials Science and Technology Conference and Exhibition 2015, MS and T 2015
PublisherAssociation for Iron and Steel Technology, AISTECH
Pages1503-1510
Number of pages8
Volume2
ISBN (Electronic)9781510813939
Publication statusPublished - 2015
Externally publishedYes
EventMaterials Science and Technology Conference and Exhibition 2015, MS and T 2015 - Columbus, United States
Duration: 4 Oct 20158 Oct 2015

Other

OtherMaterials Science and Technology Conference and Exhibition 2015, MS and T 2015
CountryUnited States
CityColumbus
Period4/10/158/10/15

Fingerprint

Roll bonding
Multilayers
Microstructure
Temperature
Textures
Dissimilar metals
Shear bands
Grain refinement
Processing
Nucleation
Metals

Keywords

  • Accumulative roll bonding
  • ARB
  • Cu
  • Interfaces
  • Ta
  • Texture

ASJC Scopus subject areas

  • Materials Science (miscellaneous)
  • Mechanics of Materials

Cite this

Mungole, T., Mansoor, B., Ayoub, G., & Field, D. P. (2015). Evolution of microstructure and microtexture in a Cu/Ta multilayer during accumulative roll-bonding at high temperature. In Materials Science and Technology Conference and Exhibition 2015, MS and T 2015 (Vol. 2, pp. 1503-1510). Association for Iron and Steel Technology, AISTECH.

Evolution of microstructure and microtexture in a Cu/Ta multilayer during accumulative roll-bonding at high temperature. / Mungole, Tarang; Mansoor, Bilal; Ayoub, Georges; Field, David P.

Materials Science and Technology Conference and Exhibition 2015, MS and T 2015. Vol. 2 Association for Iron and Steel Technology, AISTECH, 2015. p. 1503-1510.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mungole, T, Mansoor, B, Ayoub, G & Field, DP 2015, Evolution of microstructure and microtexture in a Cu/Ta multilayer during accumulative roll-bonding at high temperature. in Materials Science and Technology Conference and Exhibition 2015, MS and T 2015. vol. 2, Association for Iron and Steel Technology, AISTECH, pp. 1503-1510, Materials Science and Technology Conference and Exhibition 2015, MS and T 2015, Columbus, United States, 4/10/15.
Mungole T, Mansoor B, Ayoub G, Field DP. Evolution of microstructure and microtexture in a Cu/Ta multilayer during accumulative roll-bonding at high temperature. In Materials Science and Technology Conference and Exhibition 2015, MS and T 2015. Vol. 2. Association for Iron and Steel Technology, AISTECH. 2015. p. 1503-1510
Mungole, Tarang ; Mansoor, Bilal ; Ayoub, Georges ; Field, David P. / Evolution of microstructure and microtexture in a Cu/Ta multilayer during accumulative roll-bonding at high temperature. Materials Science and Technology Conference and Exhibition 2015, MS and T 2015. Vol. 2 Association for Iron and Steel Technology, AISTECH, 2015. pp. 1503-1510
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