Effects of oxide thickness on scale and interface stresses under isothermal cooling and micro-indentation for ferritic stainless steel interconnect

X. Sun, W. Liu, J. Vetrano, G. Yang, K. Recknagle, M. Khaleel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Interconnects in solid oxide fuel cells (SOFCs) provide the electrical connection between the individual cells, as well as separate the anode fuel from the cathode air for each cell. In this paper, we study the thermal stresses in the oxide scale and at the oxide/substrate interface for Cr-Fe based interconnect (IC), e.g. Crofer 22 APU, during cooling. The ultimate goal is to predict the interconnect life under typical operating conditions and thermal cycles. In general, very high compressive in-plane stresses are predicted in the oxide layer during cooling. High shear stress is also predicted on the oxide scale/substrate interface. The predicted shear stress on the interface will be used to compare with the experimentally determined bond strength to predict delamination. Finite element analyses are also performed for indentation test: high shear stress is predicted on the oxide/substrate interface, and the interfacial crack growth is predicted to be mode 11 driven.

Original languageEnglish
Title of host publicationECS Transactions
Pages357-368
Number of pages12
Volume5
Edition1
DOIs
Publication statusPublished - 1 Dec 2007
Externally publishedYes
Event30th Fuel Cell Seminar - Honolulu, HI, United States
Duration: 13 Nov 200617 Nov 2006

Other

Other30th Fuel Cell Seminar
CountryUnited States
CityHonolulu, HI
Period13/11/0617/11/06

Fingerprint

Ferritic steel
Indentation
Stainless steel
Cooling
Oxides
Shear stress
Substrates
Solid oxide fuel cells (SOFC)
Delamination
Thermal stress
Crack propagation
Anodes
Cathodes
Air

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sun, X., Liu, W., Vetrano, J., Yang, G., Recknagle, K., & Khaleel, M. (2007). Effects of oxide thickness on scale and interface stresses under isothermal cooling and micro-indentation for ferritic stainless steel interconnect. In ECS Transactions (1 ed., Vol. 5, pp. 357-368) https://doi.org/10.1149/1.2729017

Effects of oxide thickness on scale and interface stresses under isothermal cooling and micro-indentation for ferritic stainless steel interconnect. / Sun, X.; Liu, W.; Vetrano, J.; Yang, G.; Recknagle, K.; Khaleel, M.

ECS Transactions. Vol. 5 1. ed. 2007. p. 357-368.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sun, X, Liu, W, Vetrano, J, Yang, G, Recknagle, K & Khaleel, M 2007, Effects of oxide thickness on scale and interface stresses under isothermal cooling and micro-indentation for ferritic stainless steel interconnect. in ECS Transactions. 1 edn, vol. 5, pp. 357-368, 30th Fuel Cell Seminar, Honolulu, HI, United States, 13/11/06. https://doi.org/10.1149/1.2729017
Sun, X. ; Liu, W. ; Vetrano, J. ; Yang, G. ; Recknagle, K. ; Khaleel, M. / Effects of oxide thickness on scale and interface stresses under isothermal cooling and micro-indentation for ferritic stainless steel interconnect. ECS Transactions. Vol. 5 1. ed. 2007. pp. 357-368
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