Effect of Surface Condition on Spallation Behavior of Oxide Scale on SS 441 Substrate used in SOFC

Wenning Liu, Xin Sun, Elizabeth Stephens, Moe Khaleel

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

As operating temperature of SOFC decreases, ferritic stainless steel has attracted a great deal of attention for its use as an interconnect in SOFCs because of its gas-tightness, low electrical resistivity, ease of fabrication, and cost-effectiveness. However, oxidation reaction of the metallic interconnects in a typical SOFC working environment is unavoidable. The growth stresses in the oxide scale and on the scale/substrate interface combined with the thermal stresses induced by thermal expansion coefficient mismatch between the oxide scale and the substrate may lead to scale delamination/buckling and eventual spallation during stack cooling, which can lead to serious cell performance degradation. Therefore, the interfacial adhesion strength between the oxide scale and substrate is crucial to the reliability and durability of the metallic interconnect in SOFC operating environments. In this paper, we investigated the effect of the surface conditions on the interfacial strength of oxide scale and SS441 substrate experimentally. Contrary to the conventional sense, it was found that rough surface of SS441 substrate will decrease the interfacial adhesive strength of the oxide scale and SS441 substrate.

Original languageEnglish
Title of host publicationAdvances in Materials Science for Environmental and Nuclear Technology II
PublisherJohn Wiley and Sons Inc.
Pages81-86
Number of pages6
Volume227
ISBN (Print)9781118144527, 9781118060001
DOIs
Publication statusPublished - 9 Sep 2011
Externally publishedYes

Fingerprint

Solid oxide fuel cells (SOFC)
Oxides
Substrates
Bond strength (materials)
Stainless Steel
Ferritic steel
Cost effectiveness
Delamination
Thermal stress
Buckling
Thermal expansion
Adhesives
Durability
Stainless steel
Gases
Cooling
Fabrication
Degradation
Oxidation
Temperature

Keywords

  • Electrical resistivity
  • Oxide scale
  • Spallation
  • Surface condition
  • Thermal expansion coefficient

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Cite this

Liu, W., Sun, X., Stephens, E., & Khaleel, M. (2011). Effect of Surface Condition on Spallation Behavior of Oxide Scale on SS 441 Substrate used in SOFC. In Advances in Materials Science for Environmental and Nuclear Technology II (Vol. 227, pp. 81-86). John Wiley and Sons Inc.. https://doi.org/10.1002/9781118144527.ch9

Effect of Surface Condition on Spallation Behavior of Oxide Scale on SS 441 Substrate used in SOFC. / Liu, Wenning; Sun, Xin; Stephens, Elizabeth; Khaleel, Moe.

Advances in Materials Science for Environmental and Nuclear Technology II. Vol. 227 John Wiley and Sons Inc., 2011. p. 81-86.

Research output: Chapter in Book/Report/Conference proceedingChapter

Liu, W, Sun, X, Stephens, E & Khaleel, M 2011, Effect of Surface Condition on Spallation Behavior of Oxide Scale on SS 441 Substrate used in SOFC. in Advances in Materials Science for Environmental and Nuclear Technology II. vol. 227, John Wiley and Sons Inc., pp. 81-86. https://doi.org/10.1002/9781118144527.ch9
Liu W, Sun X, Stephens E, Khaleel M. Effect of Surface Condition on Spallation Behavior of Oxide Scale on SS 441 Substrate used in SOFC. In Advances in Materials Science for Environmental and Nuclear Technology II. Vol. 227. John Wiley and Sons Inc. 2011. p. 81-86 https://doi.org/10.1002/9781118144527.ch9
Liu, Wenning ; Sun, Xin ; Stephens, Elizabeth ; Khaleel, Moe. / Effect of Surface Condition on Spallation Behavior of Oxide Scale on SS 441 Substrate used in SOFC. Advances in Materials Science for Environmental and Nuclear Technology II. Vol. 227 John Wiley and Sons Inc., 2011. pp. 81-86
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