Effect of metallic interconnect thickness on its long-term performance in SOFCS

Wenning Liu, Xin Sun, Liz Stephens, Moe Khaleel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

At the operating environment of solid oxide fuel cells (SOFCs), oxide scale will grow on the ferritic interconnect (IC) surface unavoidably and furfures induce growth stress in oxide scale and along the interface of the oxide scale and IC substrate. A combination of growth stress with thermal stresses may lead to scale delamination/buckling and eventual spallation during SOFC stack cooling, even leading to serious degradation of cell performance. In this paper, the effect of the ferritic IC thickness on the delamination/spallation of the oxide scale was investigated numerically. The predicted results show that the interfacial shear stresses increase with the growth of the oxide scale and also with the thickness of the ferritic substrate; i.e., the thick ferritic substrate can easily lead to scale delamination and spallation.

Original languageEnglish
Title of host publicationCeramic Engineering and Science Proceedings
Pages131-138
Number of pages8
Volume32
Edition4
Publication statusPublished - 2 Dec 2011
Externally publishedYes
EventAdvances in Solid Oxide Fuel Cells VII - 35th International Conference on Advanced Ceramics and Composites, ICACC - Daytona Beach, FL, United States
Duration: 23 Jan 201128 Jan 2011

Other

OtherAdvances in Solid Oxide Fuel Cells VII - 35th International Conference on Advanced Ceramics and Composites, ICACC
CountryUnited States
CityDaytona Beach, FL
Period23/1/1128/1/11

    Fingerprint

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Liu, W., Sun, X., Stephens, L., & Khaleel, M. (2011). Effect of metallic interconnect thickness on its long-term performance in SOFCS. In Ceramic Engineering and Science Proceedings (4 ed., Vol. 32, pp. 131-138)