Dynamic scaling theory of splat cooling for resulting thickness evaluation

A. Khater, G. Barault

Research output: Contribution to journalArticle

Abstract

A general model is presented for splat cooling which lends itself to linear and to non-linear thermal exchange at the sample-substrate interface. Thermal conduction in the melt is considered to take place via phonons and electrons. The theoretical approach is developed generally, using some elements of the earlier Miyazawa and Szekeley model, and using the Jaeger solutions of the temperature distribution for a static semi-infinite medium, by scaling under the dynamic conditions of the splat. The theory is tested, for the case of newtonian cooling, by comparison with the results of Kroeger et al. We find good agreement between the theoretical predictions of our model, and their experimental data for the splat thickness of splat cooled Cu-45%Zr, Nb-45at%Rh and Ta-45at%Ir alloys, for plausible values of the heat transfer coefficient. In particular we eliminate an unnecessary parameter introduced previously to obtain agreement with these experimental data. A comparison is finally made between the calculated temperature distributions for a hypothetical but realistic melt, employing the linear Newtonian and the non-linear Stefan-Boltzmann thermal exchanges.

Original languageEnglish
Pages (from-to)179-193
Number of pages15
JournalInternational Journal of Rapid Solidification
Volume8
Issue number3
Publication statusPublished - 1994
Externally publishedYes

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Cooling
Temperature distribution
Phonons
Heat transfer coefficients
Electrons
Substrates
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Dynamic scaling theory of splat cooling for resulting thickness evaluation. / Khater, A.; Barault, G.

In: International Journal of Rapid Solidification, Vol. 8, No. 3, 1994, p. 179-193.

Research output: Contribution to journalArticle

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