Abstract
This paper presents progress made in making device-level vacuum-packaged microbolometers as infrared detectors on flexible substrates. Polyimide PI5878G serves as the flexible substrate and semiconducting Yttrium Barium Copper Oxide (YBCO) is used as the bolometeric material. Finite element analysis is used to design a vacuum cavity housing a microbolometer. Suitable materials are selected for the microcavity fabrication based on results of the computer simulations. During fabrication, sacrificial polyimide around the detector facilitates the formation of a vacuum microcavity with an optical window. Micromachining is carried out through trenches in the microcavity wall. After isolating the microbolometer from the ambient, the trenches are sealed shut by sputtering in vacuum. The fabricated devices are characterized for responsivity and detectivity. At a bias voltage of 10 V, 40×40nm2 devices exhibited a current responsivity of 6.13×10-5 A/W to a broad-band infrared radiation modulated at 5 Hz. A maximum detectivity of 1.76×105cm-Hz1/2/W was measured. A relatively low thermal conductance of 3.36×10-6 W/K was measured implying good thermal isolation of the bolometers and therefore an intact vacuum cavity.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of IEEE Sensors |
| Pages | 1153-1156 |
| Number of pages | 4 |
| Volume | 2005 |
| DOIs | |
| Publication status | Published - 2005 |
| Externally published | Yes |
| Event | Fourth IEEE Conference on Sensors 2005 - Irvine, CA, United States Duration: 31 Oct 2005 → 3 Nov 2005 |
Other
| Other | Fourth IEEE Conference on Sensors 2005 |
|---|---|
| Country | United States |
| City | Irvine, CA |
| Period | 31/10/05 → 3/11/05 |
Fingerprint
ASJC Scopus subject areas
- Engineering (miscellaneous)
- Electrical and Electronic Engineering
Cite this
Device level vacuum packaged micromachined infrared detectors on flexible substrates. / Mahmoud, Aamer; Butler, Donald P.; Çelik-Butler, Zeynep.
Proceedings of IEEE Sensors. Vol. 2005 2005. p. 1153-1156 1597909.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Device level vacuum packaged micromachined infrared detectors on flexible substrates
AU - Mahmoud, Aamer
AU - Butler, Donald P.
AU - Çelik-Butler, Zeynep
PY - 2005
Y1 - 2005
N2 - This paper presents progress made in making device-level vacuum-packaged microbolometers as infrared detectors on flexible substrates. Polyimide PI5878G serves as the flexible substrate and semiconducting Yttrium Barium Copper Oxide (YBCO) is used as the bolometeric material. Finite element analysis is used to design a vacuum cavity housing a microbolometer. Suitable materials are selected for the microcavity fabrication based on results of the computer simulations. During fabrication, sacrificial polyimide around the detector facilitates the formation of a vacuum microcavity with an optical window. Micromachining is carried out through trenches in the microcavity wall. After isolating the microbolometer from the ambient, the trenches are sealed shut by sputtering in vacuum. The fabricated devices are characterized for responsivity and detectivity. At a bias voltage of 10 V, 40×40nm2 devices exhibited a current responsivity of 6.13×10-5 A/W to a broad-band infrared radiation modulated at 5 Hz. A maximum detectivity of 1.76×105cm-Hz1/2/W was measured. A relatively low thermal conductance of 3.36×10-6 W/K was measured implying good thermal isolation of the bolometers and therefore an intact vacuum cavity.
AB - This paper presents progress made in making device-level vacuum-packaged microbolometers as infrared detectors on flexible substrates. Polyimide PI5878G serves as the flexible substrate and semiconducting Yttrium Barium Copper Oxide (YBCO) is used as the bolometeric material. Finite element analysis is used to design a vacuum cavity housing a microbolometer. Suitable materials are selected for the microcavity fabrication based on results of the computer simulations. During fabrication, sacrificial polyimide around the detector facilitates the formation of a vacuum microcavity with an optical window. Micromachining is carried out through trenches in the microcavity wall. After isolating the microbolometer from the ambient, the trenches are sealed shut by sputtering in vacuum. The fabricated devices are characterized for responsivity and detectivity. At a bias voltage of 10 V, 40×40nm2 devices exhibited a current responsivity of 6.13×10-5 A/W to a broad-band infrared radiation modulated at 5 Hz. A maximum detectivity of 1.76×105cm-Hz1/2/W was measured. A relatively low thermal conductance of 3.36×10-6 W/K was measured implying good thermal isolation of the bolometers and therefore an intact vacuum cavity.
UR - http://www.scopus.com/inward/record.url?scp=33847277550&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33847277550&partnerID=8YFLogxK
U2 - 10.1109/ICSENS.2005.1597909
DO - 10.1109/ICSENS.2005.1597909
M3 - Conference contribution
SN - 0780390563
SN - 9780780390560
VL - 2005
SP - 1153
EP - 1156
BT - Proceedings of IEEE Sensors
ER -