Device level vacuum packaged micromachined infrared detectors on flexible substrates

Aamer Mahmoud, Donald P. Butler, Zeynep Çelik-Butler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents progress made in making device-level vacuum-packaged microbolometers as infrared detectors on flexible substrates. Polyimide PI5878G serves as the flexible substrate and semiconducting Yttrium Barium Copper Oxide (YBCO) is used as the bolometeric material. Finite element analysis is used to design a vacuum cavity housing a microbolometer. Suitable materials are selected for the microcavity fabrication based on results of the computer simulations. During fabrication, sacrificial polyimide around the detector facilitates the formation of a vacuum microcavity with an optical window. Micromachining is carried out through trenches in the microcavity wall. After isolating the microbolometer from the ambient, the trenches are sealed shut by sputtering in vacuum. The fabricated devices are characterized for responsivity and detectivity. At a bias voltage of 10 V, 40×40nm2 devices exhibited a current responsivity of 6.13×10-5 A/W to a broad-band infrared radiation modulated at 5 Hz. A maximum detectivity of 1.76×105cm-Hz1/2/W was measured. A relatively low thermal conductance of 3.36×10-6 W/K was measured implying good thermal isolation of the bolometers and therefore an intact vacuum cavity.

Original languageEnglish
Title of host publicationProceedings of IEEE Sensors
Pages1153-1156
Number of pages4
Volume2005
DOIs
Publication statusPublished - 2005
Externally publishedYes
EventFourth IEEE Conference on Sensors 2005 - Irvine, CA, United States
Duration: 31 Oct 20053 Nov 2005

Other

OtherFourth IEEE Conference on Sensors 2005
CountryUnited States
CityIrvine, CA
Period31/10/053/11/05

Fingerprint

Infrared detectors
Vacuum
Microcavities
Substrates
Polyimides
Yttrium barium copper oxides
Fabrication
Bolometers
Micromachining
Bias voltage
Sputtering
Infrared radiation
Detectors
Finite element method
Computer simulation

ASJC Scopus subject areas

  • Engineering (miscellaneous)
  • Electrical and Electronic Engineering

Cite this

Mahmoud, A., Butler, D. P., & Çelik-Butler, Z. (2005). Device level vacuum packaged micromachined infrared detectors on flexible substrates. In Proceedings of IEEE Sensors (Vol. 2005, pp. 1153-1156). [1597909] https://doi.org/10.1109/ICSENS.2005.1597909

Device level vacuum packaged micromachined infrared detectors on flexible substrates. / Mahmoud, Aamer; Butler, Donald P.; Çelik-Butler, Zeynep.

Proceedings of IEEE Sensors. Vol. 2005 2005. p. 1153-1156 1597909.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mahmoud, A, Butler, DP & Çelik-Butler, Z 2005, Device level vacuum packaged micromachined infrared detectors on flexible substrates. in Proceedings of IEEE Sensors. vol. 2005, 1597909, pp. 1153-1156, Fourth IEEE Conference on Sensors 2005, Irvine, CA, United States, 31/10/05. https://doi.org/10.1109/ICSENS.2005.1597909
Mahmoud A, Butler DP, Çelik-Butler Z. Device level vacuum packaged micromachined infrared detectors on flexible substrates. In Proceedings of IEEE Sensors. Vol. 2005. 2005. p. 1153-1156. 1597909 https://doi.org/10.1109/ICSENS.2005.1597909
Mahmoud, Aamer ; Butler, Donald P. ; Çelik-Butler, Zeynep. / Device level vacuum packaged micromachined infrared detectors on flexible substrates. Proceedings of IEEE Sensors. Vol. 2005 2005. pp. 1153-1156
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