The detection of process problems and parameter drift at an early stage is crucial to successful semiconductor manufacture. The defect patterns on the wafer can act as an important source of information for quality engineers allowing them to isolate production problems. Traditionally, defect recognition is performed by quality engineers using a scanning electron microscope. This manual approach is not only expensive and time consuming but also it leads to high misidentification levels. In this paper, an automatic approach consisting of a spatial filter, a classification module and an estimation module is proposed to validate both real and simulated data. Experimental results show that three types of typical defect patterns: (i) a linear scratch; (ii) a circular ring; and (iii) an elliptical zone can be successfully extracted and classified. A Gaussian EM algorithm is used to estimate the elliptic and linear patterns, and a spherical-shell algorithm is used to estimate ring patterns. Furthermore, both convex and nonconvex defect patterns can be simultaneously recognized via a hybrid clustering method. The proposed method has the potential to be applied to other industries.
|Number of pages||10|
|Journal||IIE Transactions (Institute of Industrial Engineers)|
|Publication status||Published - 1 Dec 2006|
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Management Science and Operations Research