Design of a mini heat sink based on constructal theory for electronic chip cooling

Srikanth Srinivasan, Shaikha Al-Suwaidi, Reza Sadr

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

New technological advancements in electronic circuits and computer engineering have increased the need for better cooling systems; liquid cooling of electronic components seems to offer a solution for this problem. An important part of such solution is to design a compact cooling channel system that offers a uniform temperature distribution over the part to be cooled. This work investigates the application of constructal theory for the design of a compact double sided cooling pad for such applications. Fluid enters the two networks, on the top and bottom of the pad, via a single inlet inside a separating layer between them. The heated fluid then collected at the periphery of the channel network. An exit port is then attached to a collection well for the exit flow. Numerical method is used to redesign flow passage dimensions inside the heat sink and optimize fluid outlet layout to ensure uniform heat removal and temperature distribution in the pad. A sample model of the actual device is built; using advanced 3D printing technology, for flow study. Flow pattern, temperature distribution, and the resulted pressure drop for the designed heat sink are presented for different flow rates.

Original languageEnglish
Title of host publicationASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791846278
DOIs
Publication statusPublished - 1 Jan 2014
EventASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting - Chicago, United States
Duration: 3 Aug 20147 Aug 2014

Other

OtherASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting
CountryUnited States
CityChicago
Period3/8/147/8/14

Fingerprint

Heat sinks
Temperature distribution
Cooling
Fluids
Cooling systems
Flow patterns
Pressure drop
Printing
Numerical methods
Flow rate
Networks (circuits)
Liquids

ASJC Scopus subject areas

  • Process Chemistry and Technology

Cite this

Srinivasan, S., Al-Suwaidi, S., & Sadr, R. (2014). Design of a mini heat sink based on constructal theory for electronic chip cooling. In ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting American Society of Mechanical Engineers. https://doi.org/10.1115/ICNMM2014-22021

Design of a mini heat sink based on constructal theory for electronic chip cooling. / Srinivasan, Srikanth; Al-Suwaidi, Shaikha; Sadr, Reza.

ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers, 2014.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Srinivasan, S, Al-Suwaidi, S & Sadr, R 2014, Design of a mini heat sink based on constructal theory for electronic chip cooling. in ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers, ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting, Chicago, United States, 3/8/14. https://doi.org/10.1115/ICNMM2014-22021
Srinivasan S, Al-Suwaidi S, Sadr R. Design of a mini heat sink based on constructal theory for electronic chip cooling. In ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers. 2014 https://doi.org/10.1115/ICNMM2014-22021
Srinivasan, Srikanth ; Al-Suwaidi, Shaikha ; Sadr, Reza. / Design of a mini heat sink based on constructal theory for electronic chip cooling. ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting. American Society of Mechanical Engineers, 2014.
@inproceedings{f831ab9cbc714b75917c25cdf2aa9bcd,
title = "Design of a mini heat sink based on constructal theory for electronic chip cooling",
abstract = "New technological advancements in electronic circuits and computer engineering have increased the need for better cooling systems; liquid cooling of electronic components seems to offer a solution for this problem. An important part of such solution is to design a compact cooling channel system that offers a uniform temperature distribution over the part to be cooled. This work investigates the application of constructal theory for the design of a compact double sided cooling pad for such applications. Fluid enters the two networks, on the top and bottom of the pad, via a single inlet inside a separating layer between them. The heated fluid then collected at the periphery of the channel network. An exit port is then attached to a collection well for the exit flow. Numerical method is used to redesign flow passage dimensions inside the heat sink and optimize fluid outlet layout to ensure uniform heat removal and temperature distribution in the pad. A sample model of the actual device is built; using advanced 3D printing technology, for flow study. Flow pattern, temperature distribution, and the resulted pressure drop for the designed heat sink are presented for different flow rates.",
author = "Srikanth Srinivasan and Shaikha Al-Suwaidi and Reza Sadr",
year = "2014",
month = "1",
day = "1",
doi = "10.1115/ICNMM2014-22021",
language = "English",
booktitle = "ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting",
publisher = "American Society of Mechanical Engineers",

}

TY - GEN

T1 - Design of a mini heat sink based on constructal theory for electronic chip cooling

AU - Srinivasan, Srikanth

AU - Al-Suwaidi, Shaikha

AU - Sadr, Reza

PY - 2014/1/1

Y1 - 2014/1/1

N2 - New technological advancements in electronic circuits and computer engineering have increased the need for better cooling systems; liquid cooling of electronic components seems to offer a solution for this problem. An important part of such solution is to design a compact cooling channel system that offers a uniform temperature distribution over the part to be cooled. This work investigates the application of constructal theory for the design of a compact double sided cooling pad for such applications. Fluid enters the two networks, on the top and bottom of the pad, via a single inlet inside a separating layer between them. The heated fluid then collected at the periphery of the channel network. An exit port is then attached to a collection well for the exit flow. Numerical method is used to redesign flow passage dimensions inside the heat sink and optimize fluid outlet layout to ensure uniform heat removal and temperature distribution in the pad. A sample model of the actual device is built; using advanced 3D printing technology, for flow study. Flow pattern, temperature distribution, and the resulted pressure drop for the designed heat sink are presented for different flow rates.

AB - New technological advancements in electronic circuits and computer engineering have increased the need for better cooling systems; liquid cooling of electronic components seems to offer a solution for this problem. An important part of such solution is to design a compact cooling channel system that offers a uniform temperature distribution over the part to be cooled. This work investigates the application of constructal theory for the design of a compact double sided cooling pad for such applications. Fluid enters the two networks, on the top and bottom of the pad, via a single inlet inside a separating layer between them. The heated fluid then collected at the periphery of the channel network. An exit port is then attached to a collection well for the exit flow. Numerical method is used to redesign flow passage dimensions inside the heat sink and optimize fluid outlet layout to ensure uniform heat removal and temperature distribution in the pad. A sample model of the actual device is built; using advanced 3D printing technology, for flow study. Flow pattern, temperature distribution, and the resulted pressure drop for the designed heat sink are presented for different flow rates.

UR - http://www.scopus.com/inward/record.url?scp=85043221842&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85043221842&partnerID=8YFLogxK

U2 - 10.1115/ICNMM2014-22021

DO - 10.1115/ICNMM2014-22021

M3 - Conference contribution

BT - ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2014, Collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting

PB - American Society of Mechanical Engineers

ER -