Design and performance evaluation of a compact thermosyphon

Aniruddha Pal, Yogendra K. Joshi, Monem H. Beitelmal, Chandrakant D. Patel, Todd M. Wenger

Research output: Contribution to journalArticle

73 Citations (Scopus)


Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.

Original languageEnglish
Pages (from-to)601-607
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Issue number4
Publication statusPublished - 1 Dec 2002



  • Dielectric liquid cooling
  • Electronics cooling
  • Thermosyphon design

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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