Design and performance evaluation of a compact thermosyphon

Aniruddha Pal, Yogendra K. Joshi, Abdlmonem Beitelmal, Chandrakant D. Patel, Todd M. Wenger

Research output: Contribution to journalArticle

70 Citations (Scopus)

Abstract

Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.

Original languageEnglish
Pages (from-to)601-607
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Volume25
Issue number4
DOIs
Publication statusPublished - 1 Dec 2002
Externally publishedYes

Fingerprint

Thermosyphons
Personal computers
Microprocessor chips
Cooling
Evaporators
Boiling liquids
Electronic equipment
Fluids
Water
Hot Temperature

Keywords

  • Dielectric liquid cooling
  • Electronics cooling
  • Thermosyphon design

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

Design and performance evaluation of a compact thermosyphon. / Pal, Aniruddha; Joshi, Yogendra K.; Beitelmal, Abdlmonem; Patel, Chandrakant D.; Wenger, Todd M.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, 01.12.2002, p. 601-607.

Research output: Contribution to journalArticle

Pal, Aniruddha ; Joshi, Yogendra K. ; Beitelmal, Abdlmonem ; Patel, Chandrakant D. ; Wenger, Todd M. / Design and performance evaluation of a compact thermosyphon. In: IEEE Transactions on Components and Packaging Technologies. 2002 ; Vol. 25, No. 4. pp. 601-607.
@article{3baeede51df2480191fd3b9f225f360f,
title = "Design and performance evaluation of a compact thermosyphon",
abstract = "Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.",
keywords = "Dielectric liquid cooling, Electronics cooling, Thermosyphon design",
author = "Aniruddha Pal and Joshi, {Yogendra K.} and Abdlmonem Beitelmal and Patel, {Chandrakant D.} and Wenger, {Todd M.}",
year = "2002",
month = "12",
day = "1",
doi = "10.1109/TCAPT.2002.807997",
language = "English",
volume = "25",
pages = "601--607",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

TY - JOUR

T1 - Design and performance evaluation of a compact thermosyphon

AU - Pal, Aniruddha

AU - Joshi, Yogendra K.

AU - Beitelmal, Abdlmonem

AU - Patel, Chandrakant D.

AU - Wenger, Todd M.

PY - 2002/12/1

Y1 - 2002/12/1

N2 - Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.

AB - Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four components in a loop: an evaporator with a boiling enhancement structure, a rising tube, a condenser and a falling tube. The performance of the thermosyphon with water and PF5060 as working fluids, and the effect of inclination are studied experimentally under laboratory conditions. Experimental observations are also made at actual operating conditions to monitor the thermal behavior with changes in power output of the microprocessor. The inside cabinet of the desktop computer is also numerically simulated to understand the airside performance of the condenser.

KW - Dielectric liquid cooling

KW - Electronics cooling

KW - Thermosyphon design

UR - http://www.scopus.com/inward/record.url?scp=0036999790&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036999790&partnerID=8YFLogxK

U2 - 10.1109/TCAPT.2002.807997

DO - 10.1109/TCAPT.2002.807997

M3 - Article

VL - 25

SP - 601

EP - 607

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 4

ER -