Bifurcation in deformation behavior of Cu and Ta by accumulative roll-bonding at high temperature

Tarang Mungole, Bilal Mansoor, Georges Ayoub, David P. Field

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Cu and Ta are co-deformed at 673 K by the accumulative roll-bonding technique up to 8 passes. At an equivalent von Mises strain (ɛvm) of ~ 2 the deformation is bifurcated into shear accommodated by the ‘soft’ Cu, and plane-strain by the ‘hard-but-ductile’ Ta. This is attributed to transitions occurring collectively at ɛvm ~ 2 in crystallographic texture, partitioning of recovery and recrystallization, and the nature of interfaces as elucidated by orientation relations, Hall-Petch behavior and manifestation of instabilities at higher strain.

Original languageEnglish
Pages (from-to)87-91
Number of pages5
JournalScripta Materialia
Volume136
DOIs
Publication statusPublished - 15 Jul 2017

Fingerprint

Roll bonding
plane strain
textures
recovery
shear
Temperature
Textures
Recovery

Keywords

  • Accumulative roll bonding
  • Co-deformation
  • High-temperature deformation
  • Interfaces
  • Multilayers

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Bifurcation in deformation behavior of Cu and Ta by accumulative roll-bonding at high temperature. / Mungole, Tarang; Mansoor, Bilal; Ayoub, Georges; Field, David P.

In: Scripta Materialia, Vol. 136, 15.07.2017, p. 87-91.

Research output: Contribution to journalArticle

Mungole, Tarang ; Mansoor, Bilal ; Ayoub, Georges ; Field, David P. / Bifurcation in deformation behavior of Cu and Ta by accumulative roll-bonding at high temperature. In: Scripta Materialia. 2017 ; Vol. 136. pp. 87-91.
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