Acoustic compression for the thermal management of multi-load electronic systems

C. E. Bash, C. D. Patel, Abdlmonem Beitelmal, Ronald F. Burr

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper introduces a unique thermal management architecture that employs vapor-compression refrigeration to cool, above the dew point, multiple independently operating microprocessors in a small volume. The refrigeration system is driven by a novel acoustic compressor technology that has the virtues of, among other things, being highly variable, oil-less, and orientation independent, and thus able to operate under significant variations in loading and deployment. The paper will also, therefore, introduce acoustic compression and discuss its application to the thermal management of electronics. A prototype 5U server with four 100 W, independently variable, heat loads demonstrating the technology has been built and experimental results are reviewed.

Original languageEnglish
Title of host publicationInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
PublisherIEEE Computer Society
Pages395-402
Number of pages8
Volume2002-January
ISBN (Print)0780371526
DOIs
Publication statusPublished - 2002
Externally publishedYes
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: 30 May 20021 Jun 2002

Other

Other8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
CountryUnited States
CitySan Diego
Period30/5/021/6/02

Fingerprint

Temperature control
Acoustics
Vapor compression refrigeration
Refrigeration
Thermal load
Compressors
Microprocessor chips
Electronic equipment
Servers
Oils
Thermal management (electronics)

Keywords

  • Central Processing Unit
  • Cooling
  • Heat sinks
  • Microprocessors
  • Power dissipation
  • Refrigeration
  • Temperature
  • Thermal conductivity
  • Thermal management
  • Thermal management of electronics

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Bash, C. E., Patel, C. D., Beitelmal, A., & Burr, R. F. (2002). Acoustic compression for the thermal management of multi-load electronic systems. In InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM (Vol. 2002-January, pp. 395-402). [1012483] IEEE Computer Society. https://doi.org/10.1109/ITHERM.2002.1012483

Acoustic compression for the thermal management of multi-load electronic systems. / Bash, C. E.; Patel, C. D.; Beitelmal, Abdlmonem; Burr, Ronald F.

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. Vol. 2002-January IEEE Computer Society, 2002. p. 395-402 1012483.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bash, CE, Patel, CD, Beitelmal, A & Burr, RF 2002, Acoustic compression for the thermal management of multi-load electronic systems. in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. vol. 2002-January, 1012483, IEEE Computer Society, pp. 395-402, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002, San Diego, United States, 30/5/02. https://doi.org/10.1109/ITHERM.2002.1012483
Bash CE, Patel CD, Beitelmal A, Burr RF. Acoustic compression for the thermal management of multi-load electronic systems. In InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. Vol. 2002-January. IEEE Computer Society. 2002. p. 395-402. 1012483 https://doi.org/10.1109/ITHERM.2002.1012483
Bash, C. E. ; Patel, C. D. ; Beitelmal, Abdlmonem ; Burr, Ronald F. / Acoustic compression for the thermal management of multi-load electronic systems. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM. Vol. 2002-January IEEE Computer Society, 2002. pp. 395-402
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