A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design

Wei Xu, Bo Gao, Moaaz Ahmed, Mingzheng Duan, Bo Wang, Saqib Mohamad, Amine Bermak, Yi Kuen Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

In this paper, we presented a wafer-level encapsulated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the integrated packaging by using the proprietary InvenSense CMOS MEMS technology. For the nitrogen gas flow from -26m/s to 26m/s, the pulsed operated TMCF sensor (device size = 3.4mm2) under the Constant Temperature Difference (CTD) mode achieved a normalized sensitivity of 112.4μV/(m/s)/mW with respect to the input heating power. Besides, the measured TMCF sensor response time (τmax<3.63ms) shows good agreement with a theoretical model. With the pulsed operation, the proposed low-power TMCF sensor will be a promising digital CMOS MEMS flow sensor for the Internet of Things (IoT), especially for smart building/home.

Original languageEnglish
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages989-992
Number of pages4
ISBN (Electronic)9781509050789
DOIs
Publication statusPublished - 23 Feb 2017
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 22 Jan 201726 Jan 2017

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period22/1/1726/1/17

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Xu, W., Gao, B., Ahmed, M., Duan, M., Wang, B., Mohamad, S., Bermak, A., & Lee, Y. K. (2017). A wafer-level encapsulated CMOS MEMS thermoresistive calorimetric flow sensor with integrated packaging design. In 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 989-992). [7863577] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863577