A system-on-chip EPC Gen-2 passive UHF RFID tag with embedded temperature sensor

Jun Yin, Jun Yi, Man Kay Law, Yunxiao Ling, Man Chiu Lee, Kwok Ping Ng, Bo Gao, Howard Cam Luong, Amine Bermak, Mansun Chan, Wing Hung Ki, Chi Ying Tsui, Matthew Ming Fai Yuen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

A system-on-chip passive UHF RFID tag with embedded temperature sensor is developed in a standard 0.18μm CMOS process for the EPC Gen-2 protocol from 860-960MHz [1]. Flip-chip technology is used to bond the developed tag IC to an antenna to realize a complete tag inlay, which is successfully demonstrated and evaluated in real-time wireless communications with commercial RFID readers.

Original languageEnglish
Title of host publication2010 IEEE International Solid-State Circuits Conference, ISSCC 2010 - Digest of Technical Papers
Pages308-309
Number of pages2
DOIs
Publication statusPublished - 18 May 2010
Event2010 IEEE International Solid-State Circuits Conference, ISSCC 2010 - San Francisco, CA, United States
Duration: 7 Feb 201011 Feb 2010

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume53
ISSN (Print)0193-6530

Other

Other2010 IEEE International Solid-State Circuits Conference, ISSCC 2010
CountryUnited States
CitySan Francisco, CA
Period7/2/1011/2/10

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Yin, J., Yi, J., Law, M. K., Ling, Y., Lee, M. C., Ng, K. P., Gao, B., Luong, H. C., Bermak, A., Chan, M., Ki, W. H., Tsui, C. Y., & Yuen, M. M. F. (2010). A system-on-chip EPC Gen-2 passive UHF RFID tag with embedded temperature sensor. In 2010 IEEE International Solid-State Circuits Conference, ISSCC 2010 - Digest of Technical Papers (pp. 308-309). [5433893] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 53). https://doi.org/10.1109/ISSCC.2010.5433893