A study of the thermal stability of nano-twinned copper

Christopher Saldana, Sergey Suslov, Matt Hudspeth, Eric A. Stach, Srinivasan Chandrasekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Inadequate thermal stability has precluded the widespread application of nanostructured materials. The use of conventional stabilization methods has generally only been feasible in multi-component nanostructured systems, leaving single-component systems without an effective route to thermal stabilization. In this study, stabilization in high purity copper is demonstrated through the stability afforded by a dense network of twin boundaries. A range of microstructures, including one dominated by twins, is produced in the copper by carrying out deformation under a wide set of conditions - strain rates varying from 10 to I 03 per second, strains from I to 7 and temperatures as low as cryogenic. Stability of these microstructures is evaluated by microstructure observation, strength measurement and calorimetry. Changes in microstructure and hardness stability, as well as a switchover from grain boundary mediated diffusion to lattice or twin diffusion, is demonstrated in the case of heavily twinned copper.

Original languageEnglish
Title of host publicationTMS Annual Meeting
Pages731-738
Number of pages8
Volume2
Publication statusPublished - 2010
Externally publishedYes
EventTMS 2010 - 139th Annual Meeting and Exhibition - Seattle, WA
Duration: 14 Feb 201018 Feb 2010

Other

OtherTMS 2010 - 139th Annual Meeting and Exhibition
CitySeattle, WA
Period14/2/1018/2/10

Fingerprint

Copper
Thermodynamic stability
thermal stability
copper
microstructure
Microstructure
Stabilization
stabilization
Calorimetry
Nanostructured materials
Crystal lattices
Cryogenics
strain rate
cryogenics
Strain rate
purity
Grain boundaries
heat measurement
hardness
grain boundaries

Keywords

  • Nanostructured
  • Severe plastic deformation
  • Thermal stability
  • Twinning

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

Cite this

Saldana, C., Suslov, S., Hudspeth, M., Stach, E. A., & Chandrasekar, S. (2010). A study of the thermal stability of nano-twinned copper. In TMS Annual Meeting (Vol. 2, pp. 731-738)

A study of the thermal stability of nano-twinned copper. / Saldana, Christopher; Suslov, Sergey; Hudspeth, Matt; Stach, Eric A.; Chandrasekar, Srinivasan.

TMS Annual Meeting. Vol. 2 2010. p. 731-738.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Saldana, C, Suslov, S, Hudspeth, M, Stach, EA & Chandrasekar, S 2010, A study of the thermal stability of nano-twinned copper. in TMS Annual Meeting. vol. 2, pp. 731-738, TMS 2010 - 139th Annual Meeting and Exhibition, Seattle, WA, 14/2/10.
Saldana C, Suslov S, Hudspeth M, Stach EA, Chandrasekar S. A study of the thermal stability of nano-twinned copper. In TMS Annual Meeting. Vol. 2. 2010. p. 731-738
Saldana, Christopher ; Suslov, Sergey ; Hudspeth, Matt ; Stach, Eric A. ; Chandrasekar, Srinivasan. / A study of the thermal stability of nano-twinned copper. TMS Annual Meeting. Vol. 2 2010. pp. 731-738
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