A numerical investigation of the solidification of AL-12.6%SI alloy during mold-vibration

Numan Abu-Dheir, Marwan Khraisheh, Kozo Saito

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A simple 1-D numerical model to predict the effect of mold-vibration on the solidification of metals is presented. Mold-vibration during solidification is known to have profound effect on the microstructure and mechanical properties of castings. However, its working mechanism is not well understood yet. Inverse heat conduction method is used to estimate mold/casting heat transfer coefficient, and phase-change during the solidification of Al-12.6%Si. The results for different conditions of vibration are compared. Numerical simulation results show that mold-vibration has changed the heat transfer coefficient in a way dependant on the frequency and amplitude used. Mold-vibration also assisted the phase-change process, by reducing nucleation time and in some cases reducing the solid growth time.

Original languageEnglish
Title of host publicationMaterials Processing Under the Influence of External Fields- TMS 2007 Annual Meeting and Exhibition
Pages113-122
Number of pages10
Publication statusPublished - 1 Dec 2007
EventMaterials Processing Under the Influence of External Fields - Orlando, FL, United States
Duration: 25 Feb 20071 Mar 2007

Publication series

NameTMS Annual Meeting

Other

OtherMaterials Processing Under the Influence of External Fields
CountryUnited States
CityOrlando, FL
Period25/2/071/3/07

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Keywords

  • Casting
  • Mold vibration
  • Mold-casting interface heat transfer coefficient
  • Numerical simulation
  • Solidification time

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

Cite this

Abu-Dheir, N., Khraisheh, M., & Saito, K. (2007). A numerical investigation of the solidification of AL-12.6%SI alloy during mold-vibration. In Materials Processing Under the Influence of External Fields- TMS 2007 Annual Meeting and Exhibition (pp. 113-122). (TMS Annual Meeting).