A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications

Angelo Miele, Bill Birkas, Cliff Alapa, Wilhelm Hebenstreit, Said Mansour, Eric Edler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The purpose of this program was to evaluate the solder joint reliability, using the IPC-9701 standard as a guideline, of PCBAs that were assembled with conventional leaded and ROHS compliant lead free processes and to evaluate the capabilities of multiple PCBA assembly houses. 6 sample groups of 26 samples each from 3 different suppliers were subjected to a full qualification plan, SEM, cross-sectional imaging and EDX analysis. The groups consisted of lead free (SAC) test coupons and standard leaded (SnPb) test coupons. The test coupons were populated with surface mount daisy chained dummy components. The component finishes were SnCu and the board finishes were immersion Ag. The coupons were subjected to mechanical strength (lead pull testing, vibration and impact tests), long term reliability (damp heat, temperature cycling and whisker growth tests) and solder joint quality (cross-sectioning, SEM imaging and EDX of components). The test results were analyzed to compare the capabilities of the 3 PCBA assembly houses and to evaluate the relative differences between the conventional leaded and ROHS compliant lead free processes.

Original languageEnglish
Title of host publicationIPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007
Pages1034-1069
Number of pages36
Volume2
Publication statusPublished - 1 Dec 2007
Externally publishedYes
EventIPC Printed Circuits Expo, APEX and the Designers Summit 2007 - Los Angeles, CA, United States
Duration: 20 Feb 200722 Feb 2007

Other

OtherIPC Printed Circuits Expo, APEX and the Designers Summit 2007
CountryUnited States
CityLos Angeles, CA
Period20/2/0722/2/07

Fingerprint

Soldering alloys
Energy dispersive spectroscopy
Lead
Imaging techniques
Scanning electron microscopy
Strength of materials
Testing
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Miele, A., Birkas, B., Alapa, C., Hebenstreit, W., Mansour, S., & Edler, E. (2007). A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications. In IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007 (Vol. 2, pp. 1034-1069)

A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications. / Miele, Angelo; Birkas, Bill; Alapa, Cliff; Hebenstreit, Wilhelm; Mansour, Said; Edler, Eric.

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007. Vol. 2 2007. p. 1034-1069.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miele, A, Birkas, B, Alapa, C, Hebenstreit, W, Mansour, S & Edler, E 2007, A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications. in IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007. vol. 2, pp. 1034-1069, IPC Printed Circuits Expo, APEX and the Designers Summit 2007, Los Angeles, CA, United States, 20/2/07.
Miele A, Birkas B, Alapa C, Hebenstreit W, Mansour S, Edler E. A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications. In IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007. Vol. 2. 2007. p. 1034-1069
Miele, Angelo ; Birkas, Bill ; Alapa, Cliff ; Hebenstreit, Wilhelm ; Mansour, Said ; Edler, Eric. / A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications. IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007. Vol. 2 2007. pp. 1034-1069
@inproceedings{01bc38ae500149418b68604737341357,
title = "A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications",
abstract = "The purpose of this program was to evaluate the solder joint reliability, using the IPC-9701 standard as a guideline, of PCBAs that were assembled with conventional leaded and ROHS compliant lead free processes and to evaluate the capabilities of multiple PCBA assembly houses. 6 sample groups of 26 samples each from 3 different suppliers were subjected to a full qualification plan, SEM, cross-sectional imaging and EDX analysis. The groups consisted of lead free (SAC) test coupons and standard leaded (SnPb) test coupons. The test coupons were populated with surface mount daisy chained dummy components. The component finishes were SnCu and the board finishes were immersion Ag. The coupons were subjected to mechanical strength (lead pull testing, vibration and impact tests), long term reliability (damp heat, temperature cycling and whisker growth tests) and solder joint quality (cross-sectioning, SEM imaging and EDX of components). The test results were analyzed to compare the capabilities of the 3 PCBA assembly houses and to evaluate the relative differences between the conventional leaded and ROHS compliant lead free processes.",
author = "Angelo Miele and Bill Birkas and Cliff Alapa and Wilhelm Hebenstreit and Said Mansour and Eric Edler",
year = "2007",
month = "12",
day = "1",
language = "English",
isbn = "9781604237863",
volume = "2",
pages = "1034--1069",
booktitle = "IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007",

}

TY - GEN

T1 - A method to evaluate PCBA suppliers' Pb free vs. leaded processes for telecom applications

AU - Miele, Angelo

AU - Birkas, Bill

AU - Alapa, Cliff

AU - Hebenstreit, Wilhelm

AU - Mansour, Said

AU - Edler, Eric

PY - 2007/12/1

Y1 - 2007/12/1

N2 - The purpose of this program was to evaluate the solder joint reliability, using the IPC-9701 standard as a guideline, of PCBAs that were assembled with conventional leaded and ROHS compliant lead free processes and to evaluate the capabilities of multiple PCBA assembly houses. 6 sample groups of 26 samples each from 3 different suppliers were subjected to a full qualification plan, SEM, cross-sectional imaging and EDX analysis. The groups consisted of lead free (SAC) test coupons and standard leaded (SnPb) test coupons. The test coupons were populated with surface mount daisy chained dummy components. The component finishes were SnCu and the board finishes were immersion Ag. The coupons were subjected to mechanical strength (lead pull testing, vibration and impact tests), long term reliability (damp heat, temperature cycling and whisker growth tests) and solder joint quality (cross-sectioning, SEM imaging and EDX of components). The test results were analyzed to compare the capabilities of the 3 PCBA assembly houses and to evaluate the relative differences between the conventional leaded and ROHS compliant lead free processes.

AB - The purpose of this program was to evaluate the solder joint reliability, using the IPC-9701 standard as a guideline, of PCBAs that were assembled with conventional leaded and ROHS compliant lead free processes and to evaluate the capabilities of multiple PCBA assembly houses. 6 sample groups of 26 samples each from 3 different suppliers were subjected to a full qualification plan, SEM, cross-sectional imaging and EDX analysis. The groups consisted of lead free (SAC) test coupons and standard leaded (SnPb) test coupons. The test coupons were populated with surface mount daisy chained dummy components. The component finishes were SnCu and the board finishes were immersion Ag. The coupons were subjected to mechanical strength (lead pull testing, vibration and impact tests), long term reliability (damp heat, temperature cycling and whisker growth tests) and solder joint quality (cross-sectioning, SEM imaging and EDX of components). The test results were analyzed to compare the capabilities of the 3 PCBA assembly houses and to evaluate the relative differences between the conventional leaded and ROHS compliant lead free processes.

UR - http://www.scopus.com/inward/record.url?scp=84866920088&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866920088&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781604237863

VL - 2

SP - 1034

EP - 1069

BT - IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

ER -